Patents by Inventor Xiaofeng Bi

Xiaofeng Bi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250026435
    Abstract: The present disclosure relates to a split-type footrest. The footrest includes a sucker, a shell and a foot-pedal. The shell is fixedly connected to the sucker. The shell is provided with at least one snapping part. The foot-pedal is correspondingly provided with a hanging arm, and the head of the hanging arm is provided with a lug. The lug is used to be inserted into the snapping part so as to form a detachable snap connection. There are snapping parts symmetrically provided on both sides of the shell respectively. There are two hanging arms and they are arranged on both sides of the foot-pedal respectively. Each hanging arm is provided with a lug, and each lug extends toward the other lug. The lugs are in one-to-one correspondence with the snapping parts. The foot-pedal and the main body can be disassembled for separate transportation, thereby reducing the cost of bulk transportation.
    Type: Application
    Filed: January 25, 2024
    Publication date: January 23, 2025
    Inventors: Xiaofeng BI, Dongfang CHEN
  • Publication number: 20240382044
    Abstract: The present disclosure relates to a sucker armrest of manual air suction type. The sucker armrest includes a handle, a cover and an air sucker. The handle is fixed on the cover, and the air sucker is fixed in the cover. The air sucker includes a manual air pump, a disc and a steel ring. The steel ring is embedded in the disc, and the cover is fixedly connected to the steel ring through screws. The manual air pump is provided between the disc and the cover. An air port of the manual air pump communicates with a suction surface of the disc. When the suction force of the sucker decreases, the manual air pump can be directly used for vacuumizing to increase the suction force, without the step of detaching and reattaching the sucker, which simplifies the process of re-increasing the suction force and improves the convenience of use.
    Type: Application
    Filed: January 25, 2024
    Publication date: November 21, 2024
    Inventors: Xiaofeng BI, Lin LIANG
  • Patent number: 9153760
    Abstract: A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: October 6, 2015
    Assignee: DONGGUAN KINGSUN OPTOELECTRONIC CO., LTD
    Inventor: Xiaofeng Bi
  • Patent number: 8757473
    Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: June 24, 2014
    Assignee: Dongguan Kingsun Optoelectronic Co., Ltd
    Inventor: Xiaofeng Bi
  • Publication number: 20130298396
    Abstract: A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.
    Type: Application
    Filed: August 30, 2012
    Publication date: November 14, 2013
    Inventor: Xiaofeng Bi
  • Publication number: 20130248584
    Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.
    Type: Application
    Filed: August 30, 2012
    Publication date: September 26, 2013
    Inventor: Xiaofeng Bi