Patents by Inventor Xiaofeng Di

Xiaofeng Di has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding for semiconductor devices
    Patent number: 11901327
    Abstract: A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: February 13, 2024
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yang Lei, Xiaofeng Di, Yuyun Lou, Zhonghua Qian, Junrong Yan
  • Semiconductor device including vertical wire bonds
    Patent number: 11749647
    Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: September 5, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng, Chaur Yang Ng, Cong Zhang, Chenlin Yang, Chin-Tien Chiu
  • Wire Bonding For Semiconductor Devices
    Publication number: 20220052014
    Abstract: A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.
    Type: Application
    Filed: February 26, 2021
    Publication date: February 17, 2022
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yang Lei, Xiaofeng Di, Yuyun Lou, Zhonghua Qian, Junrong Yan
  • SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS
    Publication number: 20210366875
    Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.
    Type: Application
    Filed: December 30, 2020
    Publication date: November 25, 2021
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng, Chaur Yang Ng, Cong Zhang, Chenlin Yang, Chin-Tien Chiu
  • Semiconductor device including dual pad wire bond interconnection
    Patent number: 10483239
    Abstract: A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 19, 2019
    Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu, Jian Bin Gu
  • Semiconductor device including conductive bump interconnections
    Patent number: 10283485
    Abstract: A semiconductor device is disclosed including semiconductor die stacked in a stepped, offset configuration, where die bond pads of semiconductor die on different levels are interconnected using one or more conductive bumps.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: May 7, 2019
    Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Junrong Yan, Xiaofeng Di, Chee Keong Chin, Kim Lee Bock, Mingxia Wu
  • SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS
    Publication number: 20180337161
    Abstract: A semiconductor device is disclosed including semiconductor die stacked in a stepped, offset configuration, where die bond pads of semiconductor die on different levels are interconnected using one or more conductive bumps.
    Type: Application
    Filed: June 8, 2017
    Publication date: November 22, 2018
    Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
    Inventors: Junrong Yan, Xiaofeng Di, Chee Keong Chin, Kim Lee Bock, Mingxia Wu
  • SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
    Publication number: 20180190621
    Abstract: A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 5, 2018
    Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
    Inventors: Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu, Jian Bin Gu