Patents by Inventor Xiaofeng Duan

Xiaofeng Duan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12008833
    Abstract: A capacitive fingerprint identification apparatus, a preparation method and an electronic device can improve the performance of a capacitive fingerprint apparatus and the users' using experience. The capacitive fingerprint identification apparatus is configured to be provided on an arc-shaped surface of the electronic device, including: a capacitive fingerprint identification package structure; an arc surface structure, including a first surface and a second surface, where the first surface of the arc surface structure is a plane, the second surface of the arc surface structure is an arc surface. Setting the arc surface structure on the capacitive fingerprint identification apparatus can not only make itself and the electronic device where it is located more aesthetical in appearance and have a more three-dimensional sense, but also protect the electronic device when the electronic device is dropped, so the influence on the capacitive fingerprint identification apparatus is small.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: June 11, 2024
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Xiangying Liu, Xiaofeng Duan
  • Publication number: 20220375249
    Abstract: A capacitive fingerprint identification apparatus, a preparation method and an electronic device can improve the performance of a capacitive fingerprint apparatus and the users' using experience. The capacitive fingerprint identification apparatus is configured to be provided on an arc-shaped surface of the electronic device, including: a capacitive fingerprint identification package structure; an arc surface structure, including a first surface and a second surface, where the first surface of the arc surface structure is a plane, the second surface of the arc surface structure is an arc surface. Setting the arc surface structure on the capacitive fingerprint identification apparatus can not only make itself and the electronic device where it is located more aesthetical in appearance and have a more three-dimensional sense, but also protect the electronic device when the electronic device is dropped, so the influence on the capacitive fingerprint identification apparatus is small.
    Type: Application
    Filed: July 21, 2022
    Publication date: November 24, 2022
    Applicant: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Xiangying LIU, Xiaofeng DUAN
  • Patent number: 9496638
    Abstract: A connector with high contact density includes interior casing, first contact set, exterior casing, second contact set, and conducting element. The interior casing has a plug portion and a first slope. The first contact set is disposed in the first slope of the interior casing, and the first contact set has a plurality of first contact points. A containing space is formed inside the exterior casing, and the containing space is formed with a second slope, a second contact set is disposed in the second slope and has a plurality of second contact points. A conducting element includes an insulating main body and connecting terminals. The connecting terminals are disposed in the insulating main body and exposed to the exterior and interior of the insulating main body. The plug portion inserts into the containing space, so the first contact points contact the second contact points by the connecting terminals.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: November 15, 2016
    Assignee: NEXTRONICS ENGINEERING CORP.
    Inventors: Hou-An Su, Xiaofeng Duan, Hai-Wen Yang
  • Patent number: 7824224
    Abstract: The present invention provides a printed board connector reinforced with a circuit board, and the printed board connector includes an insulating casing, a plurality of signal modules, and a plurality of metal shielding elements. The insulating casing includes a rib. The rib extends a plurality of insulating shielding walls downwardly and the signal modules are received between the insulating shielding walls and are tightly mounted in the rib. The metal shielding elements are received between the insulating shielding walls and are tightly mounted in the rib and the signal modules. When a user presses the printed circuit connector to connect with a circuit board, the rib guides and positions the signal modules and the metal shielding elements, moreover, the rib enhances the strength of the assembling with the circuit board.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: November 2, 2010
    Assignee: Nextronics Engineering Corp.
    Inventors: Hou-An Su, Xiaofeng Duan
  • Publication number: 20100136839
    Abstract: The present invention provides a printed board connector, and the printed board connector includes an insulating casing, a plurality of signal modules, and a plurality of metal shielding elements. The insulating casing includes a rib. The rib extends a plurality of insulating shielding walls downwardly and the signal modules are received between the insulating shielding walls and are tightly mounted in the rib. The metal shielding elements are received between the insulating shielding walls and are tightly mounted in the rib and the signal modules. When a user presses the printed circuit connector to connect with a circuit board, the rib guides and positions the signal modules and the metal shielding elements, moreover, the rib enhances the strength of the assembling with the circuit board.
    Type: Application
    Filed: August 19, 2009
    Publication date: June 3, 2010
    Applicant: NEXTRONICS ENGINEERING CORP.
    Inventors: Hou-An SU, Xiaofeng DUAN