Patents by Inventor Xiaoguo Liu

Xiaoguo Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194562
    Abstract: This application provides a die package structure including a package substrate, a die, and a first package body. The package substrate has a first surface and a second surface opposite each other. The die is coupled to the package substrate, and the die has a hotspot. A heat dissipation connection point is disposed on the first surface of the package substrate, and a heat conduction channel that communicates the heat dissipation connection point with the hotspot is formed in the package substrate. A first connection terminal for connecting to an external device is disposed on the second surface. The first package body is disposed on the first surface, a heat conduction structure is formed in the first package body, and the heat conduction structure extends from the heat dissipation connection point to a surface of the first package body.
    Type: Application
    Filed: December 17, 2023
    Publication date: June 13, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Le Kang, Xiaoguo Liu, Lingcheng Yuan, Bin Xu, Zhiqiang He