Patents by Inventor Xiaohai BAI

Xiaohai BAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermistor chip and preparation method thereof
    Patent number: 11631511
    Abstract: A thermistor chip is provided, which includes a thermosensitive ceramic substrate, a surface electrode and a bottom electrode. The surface electrode and the bottom electrode are respectively arranged on the two surfaces of the thermosensitive ceramic substrate. The surface electrode is a silver layer. The bottom electrode consists of a silver layer, a titanium-tungsten alloy layer, a copper layer and a gold layer, laminating on the thermosensitive ceramic substrate in turn from inside to outside. A preparation method thereof is also provided. The thermistor chip can meet the requirements of both solder paste reflow soldering and wire bonding process simultaneously, and has the advantages of good bonding effect and high temperature resistance, high reliability and high stability.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 18, 2023
    Assignee: DINGSENSE ELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Xiaohai Bai, Mengtian Yang, Limin Tang, Qixing Bai, Jun Yang, Zhaoxiang Duan
  • THERMISTOR CHIP AND PREPARATION METHOD THEREOF
    Publication number: 20220059260
    Abstract: A thermistor chip is provided, which includes a thermosensitive ceramic substrate, a surface electrode and a bottom electrode. The surface electrode and the bottom electrode are respectively arranged on the two surfaces of the thermosensitive ceramic substrate. The surface electrode is a silver layer. The bottom electrode consists of a silver layer, a titanium-tungsten alloy layer, a copper layer and a gold layer, laminating on the thermosensitive ceramic substrate in turn from inside to outside. A preparation method thereof is also provided. The thermistor chip can meet the requirements of both solder paste reflow soldering and wire bonding process simultaneously, and has the advantages of good bonding effect and high temperature resistance, high reliability and high stability.
    Type: Application
    Filed: July 8, 2019
    Publication date: February 24, 2022
    Inventors: Xiaohai BAI, Mengtian YANG, Limin TANG, Qixing BAI, Jun YANG, Zhaoxiang DUAN