Abstract: The present disclosure discloses a method for grading a suitable construction range based on a cold island value evaluation, comprising: acquiring the relevant data for the natural ecological elements within a research range, and determining a rigid protection range; summarizing a rigid protection range chart library, and superposing all rigid protection range charts based on a GIS platform to obtain a basic suitable construction range chart; acquiring vegetation patches and water body patches located outside the rigid protection range based on ENVI and AutoCAD platforms; performing a cold island value evaluation on the vegetation and water body patches located outside the rigid protection range based on the ENVI platform to obtain a cold island value grading chart; further grading the basic suitable construction range chart to obtain a suitable construction range grading chart; and applying the suitable construction range grading chart in a planning and designing.

Abstract: A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding.

Abstract: A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding.