Abstract: A method may include acquiring NMR data using a NMR unit disposed in a borehole in a formation, where the NMR data represent characteristics of the formation. The method may also include compressing the NMR data using projection followed by adaptive quantization to generate multiple, quantized data structures, where the adaptive quantization selects a gain value from a plurality of gain values. The method may further include transmitting the multiple, quantized data structures using borehole telemetry, where the multiple, quantized data structures include an indicator for the selected gain value.

Abstract: The present invention relates to a pharmaceutical composition containing ilaprazole or a salt thereof, and a preparation method therefor. The pharmaceutical composition contains or consists of ilaprazole or a salt thereof, and a ilaprazole derivative, wherein the amount of the ilaprazole derivative in the pharmaceutical composition is not higher than 1.3 wt % (less than or equal to 1.3 wt %). The composition can be used for treating peptic ulcer bleeding and stress ulcer and preventing upper gastrointestinal hemorrhage caused by severe diseases.

Abstract: A control method includes obtaining a theoretical discharge pressure according to a geometric parameter of an outdoor unit of a multi-split air conditioner, an air supply port parameter of an indoor unit of the multi-split air conditioner, an outdoor ambient temperature, and an indoor ambient temperature, obtaining a pressure deviation according to a high pressure of the outdoor unit and the theoretical discharge pressure, and performing starting control of the multi-split air conditioner according to the pressure deviation.

Abstract: An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.