Patents by Inventor Xiaohong Yin

Xiaohong Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11901784
    Abstract: Provided is a stator coil, including: a coil conductor; a first insulating layer in which a first mica tape is wound and laminated around an outer periphery of the coil conductor; and a second insulating layer in which a second mica tape is wound and laminated around an outer periphery of the first insulating layer, wherein the first mica tape contains mica in a specific content, wherein 60 mass % or more of the mica contained in the first mica tape passes through a JIS standard sieve having a nominal opening of 250 ?m, wherein the first mica tape has a specific lamination thickness, and wherein 40 mass % or less of mica contained in the second mica tape passes through the JIS standard sieve having a nominal opening of 250 ?m.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: February 13, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takahiro Mabuchi, Xiaohong Yin, Tsubasa Mori, Makoto Tsukiji
  • Publication number: 20220243020
    Abstract: Provided is an insulating varnish composition, including: two or more kinds of epoxy resins; and a filler having an average primary particle diameter of 500 nm or less, wherein the two or more kinds of epoxy resins contain 80 mass % or more of an epoxy resin having a number of repetitions of 0 in a molecular structural formula thereof with respect to a total mass of the two or more kinds of epoxy resins.
    Type: Application
    Filed: July 16, 2019
    Publication date: August 4, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takahiro MABUCHI, Xiaohong YIN
  • Publication number: 20210351654
    Abstract: Provided is a stator coil, including: a coil conductor; a first insulating layer in which a first mica tape is wound and laminated around an outer periphery of the coil conductor; and a second insulating layer in which a second mica tape is wound and laminated around an outer periphery of the first insulating layer, wherein the first mica tape contains mica in a specific content, wherein 60 mass % or more of the mica contained in the first mica tape passes through a JIS standard sieve having a nominal opening of 250 ?m, wherein the first mica tape has a specific lamination thickness, and wherein 40 mass % or less of mica contained in the second mica tape passes through the JIS standard sieve having a nominal opening of 250 ?m.
    Type: Application
    Filed: October 11, 2018
    Publication date: November 11, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takahiro MABUCHI, Xiaohong YIN, Tsubasa MORI, Makoto TSUKIJI
  • Patent number: 10177068
    Abstract: A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: January 8, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenji Mimura, Yurie Nakamura, Xiaohong Yin, Kazuhiro Tada
  • Publication number: 20160013116
    Abstract: A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.
    Type: Application
    Filed: March 11, 2014
    Publication date: January 14, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenji MIMURA, Yurie NAKAMURA, Xiaohong YIN, Kazuhiro TADA
  • Patent number: 9029438
    Abstract: Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 ?m to 80 ?m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: May 12, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yamamoto, Takashi Nishimura, Kenji Mimura, Motoki Masaki, Seiki Hiramatsu, Xiaohong Yin
  • Publication number: 20130012621
    Abstract: Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 ?m to 80 ?m. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
    Type: Application
    Filed: December 28, 2010
    Publication date: January 10, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kei Yamamoto, Takashi Nishimura, Kenji Mimura, Motoki Masaki, Seiki Hiramatsu, Xiaohong Yin
  • Publication number: 20120039045
    Abstract: A method and device for detecting insulation degradation of a power module, which detects, in advance, degradation of an insulating sheet based on a current change immediately before breakdown of an insulation characteristic from a current value of a current flowing through the insulating sheet, thereby detecting a failure of a power module caused by the degradation of insulation.
    Type: Application
    Filed: April 1, 2010
    Publication date: February 16, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Xiaohong Yin, Takashi Nishimura, Kei Yamamoto, Kazuhiro Tada, Tatsuya Okuda, Takeshi Oi