Abstract: Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.

Abstract: A system for cooling a heat-generating electronic device in a computer system includes a printed circuit board having one or more ventilation holes and coupled to a first side of the heat-generating electronic device, and a fan assembly having a top side and a bottom side and coupled to a second side of the heat-generating electronic device. The fan assembly is disposed relative to the printed circuit board to allow air to flow into the top side of the fan assembly and into the bottom side of the fan assembly through the one or more ventilation holes. One advantage of this design is that it enables a greater volume of air to flow through the fan assembly relative to prior art designs, thereby resulting in more efficient cooling of the heat-generating electronic device.

Abstract: Embodiments of the present invention recite an electronic device comprising a chassis, a backplane, at least one heat generating component coupled with the backplane, and a fan. In embodiments of the present invention, the chassis comprises at least one air inlet disposed on a side of the chassis and at least one exhaust outlet disposed on the bottom surface of the chassis. The heat generating component is suspended from said backplane when coupled therewith and is disposed above the at least one exhaust outlet. The fan draws cooling air through the at least one air inlet and expels the cooling air through the at least one exhaust outlet.

Abstract: The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.