Patents by Inventor Xiao Hua Li

Xiao Hua Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 10257946
    Abstract: One embodiment provides an electronic device, comprising: a main body component; an adjustable display component comprising a display area, a first shape, a second shape, and an assembly that is partially changeable in shape; and at least one accommodating component; wherein the main body component supports the adjustable display component and the at least one accommodating component. Other aspects are described and claimed.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: April 9, 2019
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventor: Xiao Hua Li
  • ELECTRONIC DEVICE
    Publication number: 20170280570
    Abstract: One embodiment provides an electronic device, comprising: a main body component; an adjustable display component comprising a display area, a first shape, a second shape, and an assembly that is partially changeable in shape; and at least one accommodating component; wherein the main body component supports the adjustable display component and the at least one accommodating component. Other aspects are described and claimed.
    Type: Application
    Filed: March 27, 2017
    Publication date: September 28, 2017
    Inventor: Xiao Hua Li
  • Method for operating chemical mechanical polishing (“CMP”) tool for the manufacture of semiconductor devices
    Patent number: 6852633
    Abstract: A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: February 8, 2005
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Chien Hua Chen, Yuan Hsin Peng, Xiao Hua Li
  • Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices
    Publication number: 20040171266
    Abstract: A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.
    Type: Application
    Filed: March 8, 2004
    Publication date: September 2, 2004
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Chien Hua Chen, Yuan Hsin Peng, Xiao Hua Li