Patents by Inventor Xiaohua Wei

Xiaohua Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12320108
    Abstract: A waterway installation structure in a toilet includes a connection module. The connection module includes a module body including a watercourse and includes at least two connection pipe joints disposed on the module body and in fluid communication with the watercourse. The waterway installation structure in the toilet also includes at least two waterway modules. The at least two waterway modules include at least two waterway joints configured to be respectively connected to the at least two connection pipe joints. The at least two waterway joints are configured to be respectively inserted into the at least two connection pipe joints, or the at least two connection pipe joints are configured to be respectively inserted into the at least two waterway joints.
    Type: Grant
    Filed: September 8, 2023
    Date of Patent: June 3, 2025
    Assignee: Shanghai KOHLER Electronics, Ltd.
    Inventor: Xiaohua Wei
  • Publication number: 20240093477
    Abstract: A waterway installation structure in a toilet includes a connection module. The connection module includes a module body including a watercourse and includes at least two connection pipe joints disposed on the module body and in fluid communication with the watercourse. The waterway installation structure in the toilet also includes at least two waterway modules. The at least two waterway modules include at least two waterway joints configured to be respectively connected to the at least two connection pipe joints. The at least two waterway joints are configured to be respectively inserted into the at least two connection pipe joints, or the at least two connection pipe joints are configured to be respectively inserted into the at least two waterway joints.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 21, 2024
    Inventor: Xiaohua Wei