Abstract: A molecular marker combination linked to quantitative traits of tea plant (+)-catechin content, including a SNP site 1, a SNP site 2, a SNP site 3, a SNP site 4, a SNP site 5, a SNP site 6, a SNP site 7 and a SNP site 8, which are located in tea genomes Scaffold4239:309117, Scaffold3614: 66549, Scaffold349: 3413816, Scaffold1989: 2316385, Scaffold451: 940283, Scaffold3727:442660, Scaffold115:803980 and Scaffold920:281727, respectively, and genotypes thereof are extremely significantly correlated with the (+)-catechin content is provided. A detection method for detecting each site, and one or more molecular marker site is used to evaluate the tea plant (+)-catechin content.

Abstract: An assembly includes a premise security device, a mounting bracket, a first electrical cable, and a second electrical cable. The first electrical cable has a first electrical cable first end, connected to the premise security device controller, and a first electrical cable second end. The second electrical cable has a second electrical cable first end, electrically connected to the premise security device controller, and a second electrical cable second end. When the premise security device housing is coupled to the second mounting bracket portion, the second electrical cable second end is electrically connected to the first electrical cable second end to form an electrical circuit between the premise security device controller and the electrically connected electrical cable second ends. The premise security device controller is configured to monitor the presence of the electrical circuit and generate a tamper signal when the electrical circuit is no longer present.

Abstract: A variable frequency multiplier circuit for frequency multiplying an input signal provided by an ultra-low phase noise signal source includes a tone generator configured to generate a multiple tones from the input signal; a signal separating circuit configured to separate the multiple tones into tones of interest and idler tones, where the tones of interest are separated into one or more groups and outputted from the signal separating circuit, and the idler tones are terminated; an amplification circuit configured to amplify each group of the tones of interest to optimize small and large signal responses; and a switched filter bank configured to selectively connect a selected tone from the tones of interest to a circuit output.

Abstract: Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.

Abstract: Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.

Abstract: Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.

Abstract: A shielded high-frequency circuit module includes a conductive frame electrically coupled to a top surface of a printed circuit board and a lid. The conductive frame includes inner walls, which define a circuit region, at least a portion of which includes a circuit on the top surface of the printed circuit board. The shielded high-frequency circuit module also includes a connector for interfacing the circuit region with high-frequency signals outside the conductive frame, at least a portion of the connector being electrically coupled to the conductive frame. The inner walls of the conductive frame, the top surface of the printed circuit board and the lid define a shield surrounding the circuit region.

Abstract: Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center conductor, and a second bond wire extends from the other edge of the first center conductor to the other edge of the second center conductor. Embodiments include center conductors at different heights and having different widths, and different electrical devices, such as semiconductor integrated circuits. In a particular embodiment, ball bonding is used. In some embodiments, a tack bond is included after a ball bond to allow closer attachment of the bond wire to the edge of the conductor.

Abstract: A shield for an electronic circuit for controlling electromagnetic radiation. The circuit is constructed on a PCB having a minimum of three metal layers. The PCB includes SMT shield connectors for carrying signals to the circuit. The shield includes a metal wall portion mounted to the PCB and a removable metal lid mounted to the wall portion. The PCB, connectors, wall portion and lid together form a continuous electromagnetic barrier around the circuit.

Abstract: An electrical interconnection includes a flex-circuit having a signal conductor and a shield conductor. A mating surface of the flex-circuit has a signal conductor portion surrounded by a shield conductor portion. The signal conductor portion is electrically coupled to the signal conductor and the shield conductor portion is electrically coupled to the shield conductor.

Abstract: Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center conductor, and a second bond wire extends from the other edge of the first center conductor to the other edge of the second center conductor. Embodiments include center conductors at different heights and having different widths, and different electrical devices, such as semiconductor integrated circuits. In a particular embodiment, ball bonding is used. In some embodiments, a tack bond is included after a ball bond to allow closer attachment of the bond wire to the edge of the conductor.