Patents by Inventor Xiaojia Yang

Xiaojia Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260177474
    Abstract: Provided are a MEMS-based material corrosion electrochemical measurement sensor, a preparation method therefor, and material corrosion electrochemical measurement equipment. The sensor includes a working electrode-auxiliary electrode module including a first silicon substrate, a working electrode and an auxiliary electrode, where the first silicon substrate is provided with a recess portion, and the working electrode, the auxiliary electrode and the recess portion form an accommodation space; and a reference electrode module including a second silicon substrate and a reference electrode, where the reference electrode is disposed on one side of the second silicon substrate and forms a protruding portion, and the second silicon substrate is provided with a through hole. The protruding portion is disposed in the accommodation space, and the first silicon substrate is fixedly connected to the second silicon substrate.
    Type: Application
    Filed: November 11, 2025
    Publication date: June 25, 2026
    Applicant: University of Science and Technology Beijing
    Inventors: Xiaojia YANG, Qing LI, Renzheng ZHU, Xinyu WANG, Da WEI
  • Publication number: 20260176132
    Abstract: Provided are a silicon-metal composite MEMS-based material atmospheric corrosion sensor, a preparation method therefor, and material atmospheric corrosion detection equipment. The sensor includes a cathode-anode module and a cavity structure module. The cathode-anode module includes a first substrate, a metal anode and a metal cathode which are arranged on a surface of the first substrate and are independent from each other; the cavity structure module includes a second substrate, the second substrate is provided with a recess portion and a through hole. The recess portion extends from a first side of the second substrate to an opposite second side, and the through hole extends from a surface of the second side to the bottom of the recess portion; and the surface of the first side abuts against the surface of the first substrate, and the metal cathode and the metal anode are arranged in the recess portion.
    Type: Application
    Filed: November 14, 2025
    Publication date: June 25, 2026
    Applicant: University of Science and Technology Beijing
    Inventors: Xiaojia YANG, Qing LI, Renzheng ZHU, Xinyu WANG, Da WEI
  • Patent number: 10540573
    Abstract: Methods and apparatuses are described for automated computer text classification and routing using artificial intelligence transfer learning. A server captures historical story data from an Agile development tracking system. For each completed story, the server generates a vector based upon story-specific features and assigns a label to the vector based upon a cycle time associated with the story. The server trains a classification model using a neural network on the vectors and labels. The server captures new story data from the Agile development tracking system. For each new story, the server generates a vector based upon story-specific features and executes the trained model on the vector to generate a cycle time prediction for the new story. Based upon the cycle time prediction, the server identifies deficiencies in the new story and generates an alert message.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: January 21, 2020
    Assignee: FMR LLC
    Inventors: Pu Li, Liang Chen, XiaoJia Yang, Zanyu Xie, Yulong Zhang
  • Publication number: 20190154932
    Abstract: A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding.
    Type: Application
    Filed: January 17, 2018
    Publication date: May 23, 2019
    Inventors: Weiming SHI, Xiaohan SHEN, Hu XU, Quan SUN, Yinzhou CAI, Xiaojia YANG
  • Patent number: 10274687
    Abstract: A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: April 30, 2019
    Assignees: Jiangsu Hengtong Optical Network Technology Co., Ltd., Jiangsu Hengtong Optic-Electric Co., Ltd.
    Inventors: Weiming Shi, Xiaohan Shen, Hu Xu, Quan Sun, Yinzhou Cai, Xiaojia Yang