Abstract: Methods and apparatuses are described for automated computer text classification and routing using artificial intelligence transfer learning. A server captures historical story data from an Agile development tracking system. For each completed story, the server generates a vector based upon story-specific features and assigns a label to the vector based upon a cycle time associated with the story. The server trains a classification model using a neural network on the vectors and labels. The server captures new story data from the Agile development tracking system. For each new story, the server generates a vector based upon story-specific features and executes the trained model on the vector to generate a cycle time prediction for the new story. Based upon the cycle time prediction, the server identifies deficiencies in the new story and generates an alert message.

Abstract: A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding.

Abstract: A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding.