Patents by Inventor Xiaojin GU

Xiaojin GU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12293956
    Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang Xia, David Shia, Mohanraj Prabhugoud, Maria de la Luz Belmont, Oscar Farias Moguel, Andres Ramirez Macias, Javier Avalos Garcia, Jessica Gullbrand, Shaorong Zhou, Chia-Pin Chiu, Xiaojin Gu
  • Publication number: 20210327787
    Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 21, 2021
    Inventors: Jin YANG, Jimmy CHUANG, Xicai JING, Yuan-Liang LI, Yuyang XIA, David SHIA, Mohanraj PRABHUGOUD, Maria de la Luz BELMONT, Oscar FARIAS MOGUEL, Andres RAMIREZ MACIAS, Javier AVALOS GARCIA, Jessica GULLBRAND, Shaorong ZHOU, Chia-Pin CHIU, Xiaojin GU