Abstract: An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.

Abstract: An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may assist temperature control of the IC die when in operation. In one example, the temperature control element may have a plurality of thermal dissipating features disposed on a first surface of the IC die to efficiently control and dissipate the thermal energy from the IC die when in operation. A second surface opposite to the first surface of the IC die may include a plurality of devices, such as semiconductors transistors, devices, electrical components, circuits, or the like, that may generate thermal energy when in operation. The temperature control element may provide an IC die with high efficiency of heat dissipation that is suitable for 3D IC package structures and requirements.

Abstract: An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.

Abstract: An apparatus for cooling and containing packaged battery cells includes a first structure disposed on a printed circuit board for encasing a first battery cell, the first battery cell being electrically coupled to the circuit board, the first structure includes an external surface and an internal surface defining a first cavity in which the first battery cell is located. The apparatus further includes a first seal surrounding the first battery cell between the printed circuit board coupled to the first structure. The apparatus further includes a first thermal interface material located in the first cavity, wherein a first portion of the first thermal interface material is thermally coupled to an interior surface and a second portion of the first thermal interface material is thermally coupled to the first battery cell. The apparatus further includes a plurality of heatsink fins located on the external surface of the first structure.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: Managing of battery pack cell capacity is provided. The managing includes monitoring temperature of one or more cells within the battery pack, and based on temperature of a cell of the one or more cells being at or below a low temperature threshold, initiating discharging of cells with the battery pack at a specified discharge power level to heat the cells within the battery pack. The managing also includes, based on temperature of a cell of the one or more cells rising to or above an upper temperature threshold after initiating discharging of the cells within the battery pack, discontinuing the discharging of cells within the battery pack.

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: Managing of battery pack cell capacity is provided. The managing includes monitoring temperature of one or more cells within the battery pack, and based on temperature of a cell of the one or more cells being at or below a low temperature threshold, initiating discharging of cells with the battery pack at a specified discharge power level to heat the cells within the battery pack. The managing also includes, based on temperature of a cell of the one or more cells rising to or above an upper temperature threshold after initiating discharging of the cells within the battery pack, discontinuing the discharging of cells within the battery pack.

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

Abstract: An apparatus for cooling and containing packaged battery cells includes a first structure disposed on a printed circuit board for encasing a first battery cell, the first battery cell being electrically coupled to the circuit board, the first structure includes an external surface and an internal surface defining a first cavity in which the first battery cell is located. The apparatus further includes a first seal surrounding the first battery cell between the printed circuit board coupled to the first structure. The apparatus further includes a first thermal interface material located in the first cavity, wherein a first portion of the first thermal interface material is thermally coupled to an interior surface and a second portion of the first thermal interface material is thermally coupled to the first battery cell. The apparatus further includes a plurality of heatsink fins located on the external surface of the first structure.

Abstract: An apparatus for containing battery cells includes a containment structure disposed on a printed circuit board for encasing a first battery cell, the first battery cell being electrically coupled to the printed circuit board, the containment structure being a first blast plate structure coupled a first blast tube structure. The apparatus further includes the first blast tube structure partially surrounding the first battery cell, where a bottom surface of a first end of the first blast tube structure is coupled to a top portion of the printed circuit board. The apparatus further includes the first blast plate structure coupled to a top surface of a second end of the first blast tube structure. The apparatus further includes a first thermal interface material at least partially surrounding the first battery cell, where the first thermal interface material is located between the first battery cell and the first blast tube structure.

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

Abstract: Manufacturing electronic packages is provided with enhanced heat dissipation capabilities. The method includes providing a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. The method includes providing at least one heat transfer element coupled to, or integrated with, the thermally conductive cover between a main surface of the cover and at least one respective electronic component. Further, the method includes providing a thermal interface material disposed between the heat transfer element(s) and the respective electronic component(s), which facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s).

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further incudes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.