Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.

Abstract: An electronic device system, a manufacturing method, and a method for controlling the electronic device system, in field of heat dissipation technologies. The electronic device system includes a heat source, a plurality of fans, and a plurality of air guiding apparatuses. The heat source is located on air inlet sides of the plurality of fans, and the plurality of air guiding apparatuses are located on air outlet sides of the plurality of fans. The plurality of air guiding apparatuses are configured such that, when there is a faulty fan, an air guiding direction of an air guiding apparatus corresponding to the faulty fan and an air guiding direction of an air guiding apparatus corresponding to a neighboring fan deviate from each other.

Abstract: Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.

Abstract: Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.