Abstract: Embodiments of the disclosure present systems and methods for determining the effectiveness of warehousing. In one embodiment, the method comprises receiving warehousing information, wherein the warehousing information comprises a location and an actual transport capacity of a warehousing control center and historic logistics information associated with the warehousing control center; calculating a demanded transport capacity of the warehousing control center based on the historic logistics information and the location of the warehousing control center; determining if the demanded transport capacity is equal to or less than the actual transport capacity; determining that the warehousing is effective upon the determination that the demanded transport capacity is equal to or less than the actual transport capacity; and determining that the warehousing is ineffective if the demanded transport capacity is greater than the actual transport capacity.

Abstract: A particle exhibiting catalytic activity comprising (a) an inner core formed of an alloy material; and (b) an outer shell formed of a metal material surrounding the inner core, wherein the alloy material is selected such that the inner core exerts a compressive strain on the outer shell.

Abstract: Techniques and devices for measuring polarization crosstalk in polarization maintaining fiber by placing the PM fiber in a 1-dimensional or 2-dimensional configuration for sensing stress or strain exerted on the PM fiber at different locations along the fiber with a high spatial sensing resolution.

Abstract: The disclosed technology in this patent document includes, among others, methods apparatus for distributed measuring at least one fiber bend or stress related characteristics along an optical path of fiber under test (FUT) uses both a light input unit and a light output unit connected to the FUT at one single end.

Abstract: The present disclosure provides die cutting methods and semiconductor dies. A semiconductor substrate has a test region, isolation regions, and core regions. A device layer, an interconnection layer, and a soldering pad layer are formed on the semiconductor substrate. The soldering layer includes a plurality of soldering pads. A passivation layer covers the soldering pads and the interconnect layer, and is etched to form trenches on the soldering pads above the core regions and the test region. The passivation layer, the interconnect layer, and the device layer are etched to form isolation trenches at junctions of the isolation region and the test region, disconnecting the passivation layer, the interconnect layer and the device layer. A cutting process is performed along the test region, each of the semiconductor substrate, the device layer, the interconnect layer and the soldering pad layer is cut in two.

Abstract: There is disclosed herein a method of quantitatively determining the concentration of at least one analyte in a sample, the method comprising the steps of either: (i) adding a portion of the sample to a first analyte assay formulation and to an analyte assay reference formulation to generate a first analyte sample and analyte reference sample and determining the concentration of the at least one analyte in the sample and/or (ii) adding a portion of the sample to a second analyte assay formulation and determining the concentration of the at least one analyte in the sample. Also disclosed herein are formulations, kits of parts, systems and computer implemented methods associated with said method.

Abstract: Embodiments of the invention provide systems and methods for managing seed data in a computing system (e.g., middleware computing system). A disclosed server computer may include a processor and a memory coupled with and readable by the processor and storing therein a set of instructions which, when executed by the processor, cause the processor to perform a method. The method may include obtaining first input data via a graphical interface. The first input data indicates a first memory storage location of seed data. The seed data comprises data to initialize an application for operation. The method further includes accessing the seed data from the first memory storage location based on the first input data. The method includes storing data based on the seed data to a second memory storage location.

Abstract: Disclosed are near-field communication system, method and terminal. The near-field communication system includes a first terminal and a second terminal configured to: when it is detected that a coupling capacitance between the first terminal and the second terminal is less than a predetermined value, adjust a connection of a driving channel and/or a sensing channel of the second terminal, to adjust the coupling capacitance between the second terminal and the first terminal; and establish communication between the second terminal and the first terminal when it is detected that the coupling capacitance between the first terminal and the second terminal is greater than or equal to the predetermined value.

Abstract: In order to improve the quality of communication between electronic devices, one or more sub-channels used during communication between the electronic devices are dynamically modified based on one or more performance metrics and allowed transmit powers of the sub-channels. In particular, when the one or more performance metrics indicate that a distance between the electronic devices falls within a mid-range of distances, the one or more performance metrics may be used to guide selective changes to the sub-channels used during the communication based on the allowed transmit powers. The changes to the sub-channels used during the communication may increase, decrease or leave the total bandwidth unchanged. Moreover, by changing the sub-channels used during the communication, the allowed transmit power(s) of the sub-channel(s) used may be increased, which may improve the performance during the communication.

Abstract: A low-boron-oxygen cutting line for one-way wire winding and a manufacturing method are provided. A core material comprises 55-65 wt % of copper, 0.001-0.03 wt % of boron, 0.05-1.0 wt % of other elements which are at least two of titanium, iron, silicon, nickel, manganese, aluminum, tin, phosphorus and rare earth, less than 0.5 wt % of inevitable impurity elements, and an allowance of zinc; and a surface comprises 35.0-45.0 wt % of copper, 0.001-3.0 wt % of oxygen, 0.0005-0.5 wt % of other elements, at least two of which are titanium, iron, silicon, nickel, manganese, aluminum, tin, phosphorus and rare earth, less than 0.5 wt % of inevitable impurity elements, and an allowance of zinc. The cutting line has improved mechanical properties and strengthened discharge properties, and can cut irregularly shaped materials or those hollowed in the middle.

Abstract: The present disclosure provides die cutting methods and semiconductor dies. A semiconductor substrate has a test region, isolation regions, and core regions. A device layer, an interconnection layer, and a soldering pad layer are formed on the semiconductor substrate. The soldering layer includes a plurality of soldering pads. A passivation layer covers the soldering pads and the interconnect layer, and is etched to form trenches on the soldering pads above the core regions and the test region. The passivation layer, the interconnect layer, and the device layer are etched to form isolation trenches at junctions of the isolation region and the test region, disconnecting the passivation layer, the interconnect layer and the device layer. A cutting process is performed along the test region, each of the semiconductor substrate, the device layer, the interconnect layer and the soldering pad layer is cut in two.

Abstract: A method for fabricating a MEMS device includes providing a substrate having a front surface and a back surface, and forming a protruding engagement member on the front surface of the substrate. The protruding engagement member has an inner periphery defining a groove and an outer periphery. The method also includes forming a first trench having a first depth along the outer periphery, forming a patterned mask layer on the protruding engagement member covering the groove and exposing a portion of the first trench. The method further includes etching the exposed portion of the first trench to form a second trench having a second depth, removing the patterned mask layer, bonding the substrate with a MEMS substrate to form the MEMS device, and thinning the back surface to within the second depth. The method prevents dust from being deposited on the MEMS substrate as in the case of cutting.

Abstract: A multimode handover method and a multimode terminal are disclosed. A multimode terminal obtains a CINR value and an RSSI value of a current signal in a first communication mode and determines whether the CINR value and the RSSI value both meet a preset switching condition. If they do, a current movement speed of the multimode terminal is obtained a switching delay is selected according to the movement speed, a second communication mode is switched into according to the selected delay, and communications use the second communication mode.

Abstract: The disclosed technology includes, among others, methods and devices for measuring distributed fiber bend or stress related characteristics along an optical path of fiber under test (FUT) uses both a light input unit and a light output unit connected to the FUT at one single end.

Abstract: Techniques and devices for measuring polarization crosstalk in polarization maintaining fiber by placing the PM fiber in a 1-dimensional or 2-dimensional configuration for sensing stress or strain exerted on the PM fiber at different locations along the fiber with a high spatial sensing resolution

Abstract: The present invention provided with a power adapter comprises a housing and a power conversion circuit board mounted in the housing. The housing comprises a body, which is a generally cylindrical shell having an accommodating space, an open end and an opposite closed end, wherein the closed end and the cylindrical shell are formed into a one-pieced, integrated structure, The housing also comprises a side dead wall mounted at and adapted to the open end. The power conversion circuit board has a first end connected to the side dead wall and a second end connected to the closed end, wherein the power conversion circuit board is fixedly accommodated within a confined space enclosed by the side dead wall and the body of the housing.

Abstract: A method for fabricating a MEMS device includes providing a substrate having a front surface and a back surface, and forming a protruding engagement member on the front surface of the substrate. The protruding engagement member has an inner periphery defining a groove and an outer periphery. The method also includes forming a first trench having a first depth along the outer periphery, forming a patterned mask layer on the protruding engagement member covering the groove and exposing a portion of the first trench. The method further includes etching the exposed portion of the first trench to form a second trench having a second depth, removing the patterned mask layer, bonding the substrate with a MEMS substrate to form the MEMS device, and thinning the back surface to within the second depth. The method prevents dust from being deposited on the MEMS substrate as in the case of cutting.

Abstract: Dynamic antenna switching based on weighted signal to noise ratio (SNR). A wireless device may include multiple antennas. SNR at each active antenna may be calculated. An antenna-specific weight may be applied to each antenna's SNR. The antenna-specific weights may further be radio specific and/or transmit or receive specific in some cases. Antenna selection (possibly just for a specific radio and/or for transmit or receive operations, depending on the specificity of the antenna weights), including potentially switching which antenna is used, may be based on the resulting weighted SNR values for each antenna. If the antenna-specific weights are radio specific and/or transmit or receive operation specific, the method may be performed multiple times with different antenna-specific weights to select antenna(s) for different radios and/or for other operations.

Abstract: Dynamic antenna switching based on weighted signal to noise ratio (SNR). A wireless device may include multiple antennas. SNR at each active antenna may be calculated. An antenna-specific weight may be applied to each antenna's SNR. The antenna-specific weights may further be radio specific and/or transmit or receive specific in some cases. Antenna selection (possibly just for a specific radio and/or for transmit or receive operations, depending on the specificity of the antenna weights), including potentially switching which antenna is used, may be based on the resulting weighted SNR values for each antenna. If the antenna-specific weights are radio specific and/or transmit or receive operation specific, the method may be performed multiple times with different antenna-specific weights to select antenna(s) for different radios and/or for other operations.