Abstract: A preparation method of a polymer-derived high-temperature ceramic thin film sensor is provided. Specifically, a sensitive layer precursor layer is prepared by spraying a sensitive layer precursor liquid on an alumina substrate, and the sensitive layer precursor liquid is obtained by mixing precursor liquid with conductive powder. A protective layer precursor liquid is prepared by spraying protective layer precursor liquid on the sensitive layer precursor layer, and the protective layer precursor liquid is obtained by mixing TiB2 nano-powder, insulating powder and the precursor liquid. The protective layer precursor layer, a solder and the sensitive layer precursor layer are simultaneously pyrolyzed by a one-time pyrolysis process, and thus a protective layer, the solder joints and the sensitive layer are obtained simultaneously. Thus, there is no need to pyrolyze the sensitive layer first, saving the time for pyrolyzing the sensitive layer.

Abstract: A preparation method of a polymer-derived high-temperature ceramic thin film sensor is provided. Specifically, a sensitive layer precursor layer is prepared by spraying a sensitive layer precursor liquid on an alumina substrate, and the sensitive layer precursor liquid is obtained by mixing precursor liquid with conductive powder. A protective layer precursor liquid is prepared by spraying protective layer precursor liquid on the sensitive layer precursor layer, and the protective layer precursor liquid is obtained by mixing TiB2 nano-powder, insulating powder and the precursor liquid. The protective layer precursor layer, a solder and the sensitive layer precursor layer are simultaneously pyrolyzed by a one-time pyrolysis process, and thus a protective layer, the solder joints and the sensitive layer are obtained simultaneously. Thus, there is no need to pyrolyze the sensitive layer first, saving the time for pyrolyzing the sensitive layer.

Abstract: The present disclosure provides a display module and a display device. The display module includes: a circuit board including a first surface and a second surface opposite to the first surface; a display substrate on the first surface of the circuit board; a first glue layer on the first surface of the circuit board and surrounding the a sidewall of the display substrate; and a second glue layer on the second surface of the circuit board, wherein a transparency of the second glue layer is different from a transparency of the first glue layer.

Abstract: The embodiment of the present disclosure provides a display module, which includes a circuit board and a display panel provided on a first surface of the circuit board, wherein the display panel includes a display region and a non-display region located at a periphery of the display region; the first surface of the circuit board is also provided with a frame body, the display panel is located within the frame body, a fixing adhesive is filled between a peripheral edge of the display panel and the frame body, and the fixing adhesive also covers the non-display region of the display panel.