Patents by Inventor Xiaojun Zhuo

Xiaojun Zhuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Organic light-emitting diode array substrate and manufacturing method thereof, display apparatus
    Patent number: 11233114
    Abstract: An organic light-emitting diode array substrate and manufacturing method thereof, and display apparatus are provided. The organic light-emitting diode array substrate includes: a base substrate; a first metal layer disposed on the base substrate; a first insulating layer disposed on a side of the first metal layer far away from the base substrate; a second metal layer disposed on a side of the first insulating layer far away from the base substrate; the first metal layer includes a first power line, and the second metal layer includes a second power line; the second power line is connected in parallel with the first power line through a first via hole which penetrates the first insulating layer.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: January 25, 2022
    Assignees: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
    Inventors: Sheng Zhu, Zhengyuan Zhang, Peng Sui, Can Yuan, Xiaojun Zhuo, Tao Wang
  • Organic Light-Emitting Diode Array Substrate and Manufacturing Method Thereof, Display Apparatus
    Publication number: 20210210587
    Abstract: An organic light-emitting diode array substrate and manufacturing method thereof, and display apparatus are provided. The organic light-emitting diode array substrate includes: a base substrate; a first metal layer disposed on the base substrate; a first insulating layer disposed on a side of the first metal layer far away from the base substrate; a second metal layer disposed on a side of the first insulating layer far away from the base substrate; the first metal layer includes a first power line, and the second metal layer includes a second power line; the second power line is connected in parallel with the first power line through a first via hole which penetrates the first insulating layer.
    Type: Application
    Filed: December 5, 2017
    Publication date: July 8, 2021
    Applicants: BOE Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
    Inventors: Sheng Zhu, Zhengyuan Zhang, Peng Sui, Can Yuan, Xiaojun Zhuo, Tao Wang