Abstract: This application provides an electrical lead-out structure and a preparation method thereof, a hermetic apparatus, and an optical communication device. The electrical lead-out structure is used for hermetic package. The electrical lead-out structure includes a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up, the reinforcing layer is provided with a window that passes through the reinforcing layer, the electrical signal layer is adjacent to the window, the packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is insulatingly adjacent to the electrical signal layer. The packaging layer is disposed on the flexible circuit board, so that in the electrical lead-out structure, a feed-through area used for soldering to a hermetic housing is formed.

Abstract: This application relates to the field of optical communication technologies. An optical engine assembly (103), an optical interconnection system (1000), and a network device (3000) are provided. The optical engine assembly (103) includes an optical engine (10), a coupling base (30), and a fiber array unit (50). A first guide portion (33) is disposed on the coupling base (30), a second guide portion (515) is disposed on the fiber array unit (50), and one of the first guide portion (33) and the second guide portion (515) is a guide rod. The other of the first guide portion (33) and the second guide portion (515) is a guide hole, and the guide rod is pluggably connected to the guide hole. The optical engine (10) is configured to implement conversion between an optical signal and an electrical signal.