Patents by Inventor Xiaoke Ren

Xiaoke Ren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12049998
    Abstract: A device is described that includes a carrier that has a plurality of light-emitting diode (LED) mounting areas. Each of the LED mounting areas includes a pair of contact pads, which are electrically coupled to the LED mounting area in a first subset of the plurality of LED mounting areas or electrically connected in series with a shunting element in the respective LED mounting area in a second subset of the plurality of LED mounting areas. In some embodiments, LEDs may be placed in the first subset of the plurality of LED mounting areas.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: July 30, 2024
    Assignee: LUMILEDS, LLC
    Inventors: Chentian Feng, Xiaoke Ren, Jun Zhang
  • Publication number: 20230025975
    Abstract: A device is described that includes a carrier that has a plurality of light-emitting diode (LED) mounting areas. Each of the LED mounting areas includes a pair of contact pads, which are electrically coupled to the LED mounting area in a first subset of the plurality of LED mounting areas or electrically connected in series with a shunting element in the respective LED mounting area in a second subset of the plurality of LED mounting areas. In some embodiments, LEDs may be placed in the first subset of the plurality of LED mounting areas.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 26, 2023
    Applicant: LUMILEDS LLC
    Inventors: Chentian FENG, Xiaoke REN, Jun ZHANG
  • Publication number: 20190378956
    Abstract: The present disclosure provides a light emitting module including: a substrate supporting at least one light emitting component; an enclosing component surrounding the light emitting component and defining an interspace between an inner surface of the enclosing component and the light emitting component; a coating material applied in the interspace between the enclosing component and the light emitting component. The enclosing component is attached as a separate component on the substrate. The light emitting module according to the present disclosure has an improved manufacturing effectiveness and convenience, and less complexity, thus reducing the production cost.
    Type: Application
    Filed: June 6, 2019
    Publication date: December 12, 2019
    Inventors: Kang Lu, Hui-Kai Hsu, Xiaoke Ren, Meng Han