Patents by Inventor Xiao Li Wu

Xiao Li Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111836
    Abstract: Data processing is disclosed in various aspects. For instance, an example method includes acquiring a plurality of objects with a sortable schema, the sortable schema specifying at least one field of the plurality of objects; determining metadata, sortable data, and non-sortable data of the plurality of objects on the basis of a value of the at least one field of the plurality of objects; and generating a serialized representation of the plurality of objects on the basis of the metadata, the sortable data, and the non-sortable data. By the method, one group of objects is converted into a serialized representation with sortable information, so that efficient object searching can be achieved without relying on an additional comparator.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 4, 2024
    Inventors: Xia Wang, Xiao Le Shang, Wesley Wei Sun, Young Yangchun Wu, Xiangdong Huang, Xin Li
  • Publication number: 20240111810
    Abstract: Data reads and related data reading processes are described. An example data read method includes: receiving a data read request, the data read request being aimed at target node data stored in a target node of a B+ tree; acquiring node location information, the node location information indicating a storage location of node data in a node data set of the B+ tree, and the node data set including the target node data; and determining a target storage location of the target node data. Beneficially, data stored in the B+ tree can be read and updated efficiently while reducing computing overhead.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 4, 2024
    Inventors: Xiao Le Shang, Xia Wang, Xiangdong Huang, Wesley Wei Sun, Young Yangchun Wu, Xin Li
  • Patent number: 5494950
    Abstract: An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).
    Type: Grant
    Filed: April 6, 1994
    Date of Patent: February 27, 1996
    Assignee: Totokasei Co., Ltd.
    Inventors: Hideyasu Asakage, Michio Aritomi, Xiao Li Wu