Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes at least one of a first linear extending portion, a second linear extending portion and a third linear extending portion. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.

Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes at least one of a first linear extending portion, a second linear extending portion and a third linear extending portion. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.

Abstract: A light-emitting substrate includes a back plate, light-emitting groups, a bonding electrode group, and a flexible circuit structure including a gold finger electrically connected to the bonding electrode group. A light-emitting region of the light-emitting substrate is provided with at least one light-emitting group including a first light-emitting group. The bonding electrode group includes: a first bonding electrode and remaining bonding electrodes, and at least one redundant bonding electrode between the first bonding electrode and an adjacent remaining bonding electrode. A second power supply voltage terminal of the first light-emitting group and the first bonding electrode are electrically connected to a feedback signal line. On the back plate, an orthographic projection of the gold finger overlaps with an orthographic projection of the bonding electrode group.

Abstract: A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

Abstract: The present application provides a light emitting panel, a preparation method thereof, and a light emitting apparatus, which relate to the field of display technology. The light emitting panel includes a base; a reflective layer located on a side of the base, the reflective layer includes a plurality of grooves arranged in an array; a plurality of devices located in the grooves and electrically connected to the base; a first optical film located on a side of the reflective layer facing away from the base, the orthographic projection of the first optical film on the base covers the orthographic projection of the reflective layer on the base, and at least partial areas of the reflective layer are in direct contact with the first optical film.

Abstract: A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

Abstract: A light-emitting substrate includes a back plate, light-emitting regions arranged in an array and a bonding electrode group. The light-emitting regions are disposed on the back plate, and each light-emitting region is provided with at least one light-emitting group therein. The bonding electrode group is disposed on the back plate and includes a first bonding electrode and remaining bonding electrodes. A second power supply voltage terminal of a light-emitting group is electrically connected to a feedback signal line included in the light-emitting substrate, and the first bonding electrode is electrically connected to the feedback signal line. An impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger then an impedance between two adjacent and consecutive ones of the remaining bonding electrodes.

Abstract: A light-emitting substrate includes a substrate, a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate; the reflective layer has a plurality of openings, the plurality of openings include a plurality of first openings, and a light-emitting device is located in a first opening; the reflective layer includes a plurality of first reflective portions and a second reflective portion connecting any two adjacent first reflective portions; a first reflective portion, corresponding to the light-emitting device, is located on at least one side of the light-emitting device; a thickness of the first reflective portion is less than a thickness of the second reflective portion.

Abstract: The embodiments of the present disclosure provide a light-emitting substrate and a manufacturing method thereof, a backlight module, and a display device, and the light-emitting substrate includes a base substrate, a light-emitting device and a reflective layer on the base substrate. The reflective layer has an opening, and the light-emitting device is in the opening and spaced apart from the reflective layer; the reflective layer includes an edge part close to the light-emitting device and defining the opening, and a body part on a side of the edge part away from the light-emitting device, wherein the edge part has a plurality of reflective edges facing the light-emitting device and defining the opening, and a plurality of reflective included angles formed by the reflective edges interesting with each other, and the reflective included angles include included angles that are not completely identical in shape or angle.

Abstract: A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.

Abstract: A light-emitting substrate includes: a substrate, a reflective layer, a reflective sheet, and a plurality of light-emitting devices. The reflective layer is located on a side of the substrate, and the reflective layer has a plurality of annular patterns arranged at intervals. The reflective sheet is located on a side of the reflective layer away from the substrate, and the reflective sheet has a plurality of first openings. An annular pattern is exposed by a corresponding first opening; and in a direction perpendicular to a plane where the substrate is located, an outer sidewall of the annular pattern surrounds the corresponding first opening, and an inner sidewall of the annular pattern is located in the corresponding first opening. A light-emitting device is located in an inner sidewall of one of the annular patterns.

Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes at least one of a first linear extending portion, a second linear extending portion and a third linear extending portion. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.

Abstract: The present application provides a light emitting panel, a preparation method thereof, and a light emitting apparatus, which relate to the field of display technology. The light emitting panel includes a base; a reflective layer located on a side of the base, the reflective layer includes a plurality of grooves arranged in an array; a plurality of devices located in the grooves and electrically connected to the base; a first optical film located on a side of the reflective layer facing away from the base, the orthographic projection of the first optical film on the base covers the orthographic projection of the reflective layer on the base, and at least partial areas of the reflective layer are in direct contact with the first optical film.

Abstract: A light-emitting substrate includes a back plate, light-emitting regions arranged in an array and a bonding electrode group. The light-emitting regions are disposed on the back plate, and each light-emitting region is provided with at least one light-emitting group therein. The bonding electrode group is disposed on the back plate and includes a first bonding electrode and remaining bonding electrodes. A second power supply voltage terminal of a light-emitting group is electrically connected to a feedback signal line included in the light-emitting substrate, and the first bonding electrode is electrically connected to the feedback signal line. An impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger then an impedance between two adjacent and consecutive ones of the remaining bonding electrodes.

Abstract: A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes a first linear extending portion, a second linear extending portion and a third linear extending portion that are sequentially connected. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.

Abstract: The present disclosure relates to a composition, a substrate and a preparation method of a light reflection layer. The composition comprises: a matrix material and an additive, the matrix material including a solvent, reactant molecules and a material with reflection function dispersed in the solvent, wherein the reactant molecules is capable of undergoing cross-linking reaction under a first preset condition, and include monomer molecules and/or prepolymer molecules; the additive including a filler material that is in the form of powder or microspheres, capable of being dispersed in the matrix material, and filled between the crosslinking points of any adjacent reactant molecules to block the crosslinking reaction of some adjacent reactant molecules under the first preset condition.

Abstract: A light-emitting substrate includes a substrate, a reflective layer, at least one first alignment mark disposed on the substrate, a plurality of support columns and a plurality of light-emitting devices. The reflective layer is disposed on the substrate, and the reflective layer has a plurality of openings and a plurality of installation openings. The plurality of openings include at least one first opening. A first alignment mark is exposed by a first opening. In at least one support column, an orthogonal projection of a support column on the substrate at least partially overlaps with an orthogonal projection of an opening on the substrate. The plurality of light-emitting devices are disposed on the substrate, and a light-emitting device is located in an installation opening in the reflective layer.

Abstract: A light-emitting substrate includes: a substrate having a first surface; a plurality of light-emitting devices located on the first surface; a reflective layer located on the first surface, the reflective layer having a plurality of first openings, a light-emitting device being located in a first opening; a plurality of dam structures located on the reflective layer, each dam structure having a second opening, an orthogonal projection of a first opening on the substrate being located within an orthogonal projection of the second opening on the substrate; and a plurality of first encapsulation structures located on a side of the plurality of light-emitting devices away from the substrate, a first encapsulation structure covering at least one light-emitting device, the orthogonal projection of the second opening on the substrate being located within an orthographic projection of the first encapsulation structure on the substrate.

Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes a first linear extending portion, a second linear extending portion and a third linear extending portion that are sequentially connected. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.