Abstract: Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.

Abstract: Various embodiments may relate to an illuminating device including a housing, an electronic assembly accommodated in the housing, and at least one adjusting mechanism arranged on at least one side of the electronic assembly, the adjusting mechanism is in operative connection with the electronic assembly and is operated from outside of the housing so that the electronic assembly is tensionedly held in the housing.

Abstract: Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.

Abstract: Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.

Abstract: A method for making a cooling body for a lighting device may include: a) Providing multiple aluminum nitride ceramic radiators; b) Putting the multiple aluminum nitride ceramic radiators into a mold; c) Closing the mold, and injecting a melting metal into the mold so that the metal encloses a portion of each of the aluminum nitride ceramic radiators, wherein the metal has a melting point lower than that of the aluminum nitride ceramic radiators; and d) Opening the mold, and obtaining the cooling body.

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract: A method for making a cooling body for a lighting device may include: a) Providing multiple aluminum nitride ceramic radiators; b) Putting the multiple aluminum nitride ceramic radiators into a mold; c) Closing the mold, and injecting a melting metal into the mold so that the metal encloses a portion of each of the aluminum nitride ceramic radiators, wherein the metal has a melting point lower than that of the aluminum nitride ceramic radiators; and d) Opening the mold, and obtaining the cooling body.

Abstract: A lighting module for illuminating device may include at least one lighting component; at least one lighting component bracket bearing its corresponding lighting component; and one mounting trail, wherein each lighting component bracket is mounted onto the mounting trail and fixed onto a shell of the illuminating device by the mounting trail.

Abstract: A heat pipe may include a tube body, a capillary structure provided on an inner wall of the tube body, and a cooling liquid accommodated in the tube body. The tube body and the capillary structure are made of thermal conductive plastic, respectively.

Abstract: Various embodiments may relate to an illuminating device including a housing, an electronic assembly accommodated in the housing, and at least one adjusting mechanism arranged on at least one side of the electronic assembly, the adjusting mechanism is in operative connection with the electronic assembly and is operated from outside of the housing so that the electronic assembly is tensionedly held in the housing.

Abstract: Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract: A circuit board (1) for mounting at least one light source (10), comprising a substrate (2) and a plurality of printed electrical conductors (3) printed on the substrate (2), At least one printed electrical conductor (3) comprises a first region (4) for arranging the light sources (10). The circuit board (1) further comprises reflectors (5) which are disposed between the printed electrical conductors (3) adjacent to each other and cover other regions of the printed electrical conductors (3) than the first region (4), wherein the reflectors (5) are insulating reflectors. The circuit board is easy to manufacture, has relatively high reflective property, and can efficiently reflect the light emitted from the light source. Also disclosed are a method for manufacturing the circuit board, and an illumination device comprising the circuit board.

Abstract: An LED lighting assembly may include: a substrate, a metal layer applied on the substrate, and an LED chip provided on the metal layer, wherein the metal layer comprises a first region for heat dissipation and two second regions for electric conduction, and the first region and the two second regions are electrically insulated from each other, and wherein the LED chip is provided in the first region and is respectively electrically connected with the two second regions via wires.

Abstract: An electronic module to be mounted on a mounting surface may include: a circuit board provided with a heat source, wherein a thermal via is formed through the circuit board and is in thermal contact with the heat source; and a potting material packaging the circuit board at least at the other side opposite to one side of heat source, wherein the potting material has a recess formed in at least part of an area corresponding to the thermal via at the other side of the circuit board and a thermal conductive material, which is thermal-conductively connected to the mounting surface, is filled in the recess.

Abstract: A modular heat sink for LED luminaire may include at least two modular heat sink units, which are joined together in thermal communication with each other for use in the LED luminaire, such that the illuminating angle of the LED luminaire can be adjusted within a range of 0° to 180°.

Abstract: A lighting module for illuminating device may include at least one lighting component; at least one lighting component bracket bearing its corresponding lighting component; and one mounting trail, wherein each lighting component bracket is mounted onto the mounting trail and fixed onto a shell of the illuminating device by the mounting trail.

Abstract: A method for making a cooling body for a lighting device may include: a) Providing multiple aluminum nitride ceramic radiators; b) Putting the multiple aluminum nitride ceramic radiators into a mold; c) Closing the mold, and injecting a melting metal into the mold so that the metal encloses a portion of each of the aluminum nitride ceramic radiators, wherein the metal has a melting point lower than that of the aluminum nitride ceramic radiators; and d) Opening the mold, and obtaining the cooling body.