Abstract: Concurrent servicing of a first cable of a cable pair while a second cable of the cable pair remains operational improves multi-processor computer system availability and serviceability. A pair of processing chips in different processing drawers may continue operation by way of the second cable while the first cable is degraded or serviced. Upon the servicing of the first cable, the serviced cable may transition to a fully operational state with no interruptions to the operations between the processing drawers by way of the second cable. Since cable faults are typically more common than processing chip or processing drawer faults, identification of cable faults and the ability to maintain operations of the processing drawers connected therewith is increasingly important.

Abstract: Concurrent servicing of a first cable of a cable pair while a second cable of the cable pair remains operational improves multi-processor computer system availability and serviceability. A pair of processing chips in different processing drawers may continue operation by way of the second cable while the first cable is degraded or serviced. Upon the servicing of the first cable, the serviced cable may transition to a fully operational state with no interruptions to the operations between the processing drawers by way of the second cable. Since cable faults are typically more common than processing chip or processing drawer faults, identification of cable faults and the ability to maintain operations of the processing drawers connected therewith is increasingly important.

Abstract: Circuits for shielding devices from electromagnetic coupling with through-silicon vias are shown that include a substrate having a through via, which provides access to a device layer on a first surface of the circuit to a device layer on a second surface of the circuit; a conductive layer on the first side of the substrate; a contact point on one of the device layers; and a grounded buried interface tie on the conductive layer, adjacent to the contact point, to isolate the contact point from coupling noise.

Abstract: Circuits for shielding devices from electromagnetic coupling with through-silicon vias are shown that include a substrate having a through via, which provides access to a device layer on a first surface of the circuit to a device layer on a second surface of the circuit; a conductive layer on the first side of the substrate; a contact point on one of the device layers; and a grounded buried interface tie on the conductive layer, adjacent to the contact point, to isolate the contact point from coupling noise.