Abstract: The embodiment of the present disclosure provides a display panel and a display apparatus. The display panel includes a long side, a short side, a display pixel, a scan driving circuit, a drive circuit board, and chips on film. one end of each chip on film is coupled to the short side, and another end is coupled to the drive circuit board. The drive circuit board and the scan driving circuit of the embodiment of the present disclosure are respectively located on the short side and the long side of the display panel to improve the problem that the font is easily deformed during display.

Abstract: A method for preparing a non-human mammal or progeny thereof, and the use thereof. The preparation method includes making a CH1 domain of an IgM heavy chain constant region not expressed or incorrectly expressed in the non-human mammal; and making one, two, three, four or more genes encoding an IgG heavy chain constant region in the non-human mammal not express or incorrectly express a CH1 domain during expression. The obtained non-human mammal or progeny thereof can be used for preparing a heavy chain antibody. The non-human mammal obtained by using the preparation method of the present application does not introduce any exogenous gene encoding heavy chain variable and constant regions of an antibody, and can directly use all VDJ genes encoding the heavy chain variable region of the antibody in its own genome, so as to produce more diverse heavy chain antibodies.

Abstract: A system can predict memory device failure through identification of correctable error patterns based on the memory architecture. The failure prediction can thus account for the circuit-level of the memory rather than the mere number or frequency of correctable errors. A failure prediction engine correlates hardware configuration of the memory device with correctable errors (CEs) detected in data of the memory device to predict an uncorrectable error (UE) based on the correlation.

Abstract: A system can predict what pages of memory the system should offline based on identification of how correctable error patterns correlate to the memory architecture. The failure prediction can account for the circuit-level architecture of the memory rather than the mere number or frequency of correctable errors. A controller correlates the hardware configuration of the memory with historical error data, and generates an estimate of pages for a host operating system (OS) to offline based on predicting uncorrectable errors (UEs).

Abstract: Methods and apparatus for lifetime telemetry on memory error statistics to improve memory failure analysis and prevention. Memory error information corresponding to detected correctable errors and uncorrectable memory errors are monitored, with the memory error information identifying an associated DRAM device in an associated DIMM. Corresponding micro-level error bits information from the memory error information is decoded and Micro-level Error Statistic Indicators (MESIs) are generated. Information associated with the MESIs from DRAM devices on the DIMMs are periodically written to persistent storage on those DIMMs. The MESIs for a given DIMM are updated over the lifetime of the DIMM.

Abstract: Disclosed is a semiconductor device and method of manufacturing a semiconductor device that includes planarizing surfaces of a semiconductor substrate and a carrier substrate and then placing the semiconductor substrate on the carrier substrate such that the planarized surfaces of each are adjoining and allowing the semiconductor substrate to bond to the carrier substrate using a Van der Waals force. The method also includes forming a metal filled trench around the semiconductor substrate and in contact with the carrier substrate, which can also be formed of metal. The metal filled trench and carrier substrate together form a metal cage-like structure around the semiconductor substrate that can serve as a heat sink, integrated heat spreader, and Electro-Magnetic Interference shield for the semiconductor substrate.

Abstract: Disclosed is a method of manufacturing a semiconductor device that includes a semiconductor die surrounded by a support frame for strengthening the semiconductor device compared to prior devices. A framing member is adhered to a carrier substrate along with dies that are positioned within through-holes in the framing member. The framing member and dies are encapsulated within a molding compound. The carrier substrate is then removed, and an RDL is formed on the dies. The resulting structure is then diced along portions of the framing structure into individual semiconductor devices, leaving portions of the framing structure in place and surrounding the dies as support frames.

Abstract: Disclosed is a semiconductor device and method of manufacturing a semiconductor device that includes planarizing surfaces of a semiconductor substrate and a carrier substrate and then placing the semiconductor substrate on the carrier substrate such that the planarized surfaces of each are adjoining and allowing the semiconductor substrate to bond to the carrier substrate using a Van der Waals force. The method also includes forming a metal filled trench around the semiconductor substrate and in contact with the carrier substrate, which can also be formed of metal. The metal filled trench and carrier substrate together form a metal cage-like structure around the semiconductor substrate that can serve as a heat sink, integrated heat spreader, and Electro-Magnetic Interference shield for the semiconductor substrate.

Abstract: An automated measurement system includes multi-axis imager configured to receive images of a workpiece wherein the images include visual information about the workpiece at a plurality of focus planes or visual information about the workpiece between at least two focus planes. The multi-axis imager is also configured to determine a point cloud of a plurality of 3 D data points wherein each of the plurality of 3 D data points represents an intersection of one of the plurality of focus planes with a surface of the workpiece or positional information of the workpiece in a de-focused area between the at least two focus planes. The multi-axis imager is further configured to determine a plurality of dimensions of features of the workpiece and compare the determined plurality of dimensions of the features to manufacturing specifications corresponding to at least some of the determined plurality of dimensions of the features.

Abstract: An automated measurement system includes multi-axis imager configured to receive images of a workpiece wherein the images include visual information about the workpiece at a plurality of focus planes or visual information about the workpiece between at least two focus planes. The multi-axis imager is also configured to determine a point cloud of a plurality of 3 D data points wherein each of the plurality of 3 D data points represents an intersection of one of the plurality of focus planes with a surface of the workpiece or positional information of the workpiece in a de-focused area between the at least two focus planes. The multi-axis imager is further configured to determine a plurality of dimensions of features of the workpiece and compare the determined plurality of dimensions of the features to manufacturing specifications corresponding to at least some of the determined plurality of dimensions of the features.

Abstract: A method for obtaining an edge prep profile of a cutting tool with a point sensor. The method includes: (a) scanning edge points of the cutting tool, including a target edge point on a target edge, with the point sensor, by rotating the cutting tool around its axis, to generate a first point cloud; (b) repositioning the point sensor and cutting tool relative to each other based on the location and orientation information of the target edge point, such that the sensor focus is at a region of interest containing the target edge point; and (c) scanning the region of interest using the point sensor to generate a second point cloud. The first point cloud includes location and orientation information of the target edge point. The second point cloud includes information for edge profile analysis.

Abstract: A method for extracting gash parameters of a cutting tool, comprises positioning the cutting tool on a moveable stage, scanning two or more gash sections of the cutting tool to generate two or more gash section scanning point clouds, indexing multiple points of the gash section scanning point clouds, detecting multiple gash features using the indexed gash section scanning point clouds, projecting multiple point clouds of the gash features of the indexed gash section scanning point clouds to form one or more projected gash feature point clouds, identifying one or more types of the one or more projected gash feature point clouds, segmenting the one or more projected gash feature point clouds based on the type identification, and extracting one or more gash parameters based on the segmentation of the one or more projected gash feature point clouds. A system for extracting the parameters is also presented.

Abstract: A method for extracting parameters of a cutting tool is provided. The method comprises positioning the cutting tool on a moveable stage, performing one or more rotary scans of a first section of the cutting tool to generate a scanning point cloud, indexing a plurality of points of the scanning point cloud, detecting one or more feature points based on the indexed scanning point cloud, and extracting one or more parameters based on the detected feature points. A system for extracting the parameters is also presented.

Abstract: A method of calibrating an inspection system is provided. The method includes contacting a test part with a run-out measurement device and rotating the test part and measuring a first run-out using the run-out measurement device. The method also includes moving the run-out measurement device to a new position and repeating the steps of contacting and rotating the test part to measure a second run-out at the new position. The method further includes using the first and second run-outs to adjust measurements of the inspection system.

Abstract: A method for measurement of a cutting tool is provided. The method comprises positioning the cutting tool on a moveable stage, performing a first rotary scan of a first section of the cutting tool to generate a first scanning point cloud, segmenting the first scanning point cloud, performing a second rotary scan of the first section based on the segmentation of the first scanning point cloud, and extracting the parameters of the first section based on the second rotary scan of the first section. A system for extracting parameters of a cutting tool is also presented.

Abstract: A method for extracting gash parameters of a cutting tool, comprises positioning the cutting tool on a moveable stage, scanning two or more gash sections of the cutting tool to generate two or more gash section scanning point clouds, indexing multiple points of the gash section scanning point clouds, detecting multiple gash features using the indexed gash section scanning point clouds, projecting multiple point clouds of the gash features of the indexed gash section scanning point clouds to form one or more projected gash feature point clouds, identifying one or more types of the one or more projected gash feature point clouds, segmenting the one or more projected gash feature point clouds based on the type identification, and extracting one or more gash parameters based on the segmentation of the one or more projected gash feature point clouds. A system for extracting the parameters is also presented.

Abstract: A method of measuring an object includes positioning the object on a moveable stage, performing a rotary scan of the object with a range sensor, and determining geometric parameters of the object based on the rotary scan.

Abstract: A method for extracting parameters of a cutting tool is provided. The method comprises positioning the cutting tool on a moveable stage, performing one or more rotary scans of a first section of the cutting tool to generate a scanning point cloud, indexing a plurality of points of the scanning point cloud, detecting one or more feature points based on the indexed scanning point cloud, and extracting one or more parameters based on the detected feature points. A system for extracting the parameters is also presented.

Abstract: A method for extracting parameters of a cutting tool is provided. The method includes obtaining a measurement data set having a point cloud corresponding to a surface of the cutting tool and virtually slicing the point cloud at a pre-determined section to obtain a set of points on the pre-determined section. The method also includes generating a plurality of curves through the set of points and optimizing the plurality of curves to generate optimized fitting curves and extracting the parameters of the cutting tool from the optimized fitting curves. Furthermore, based on the presented rotary angle projection technique, a plurality of parameters can be extracted for the cutting tool.

Abstract: A method of calibrating an inspection system is provided. The method includes contacting a test part with a run-out measurement device and rotating the test part and measuring a first run-out using the run-out measurement device. The method also includes moving the run-out measurement device to a new position and repeating the steps of contacting and rotating the test part to measure a second run-out at the new position. The method further includes using the first and second run-outs to adjust measurements of the inspection system.