Patents by Inventor Xiaopeng Qu

Xiaopeng Qu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210204446
    Abstract: Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.
    Type: Application
    Filed: March 15, 2021
    Publication date: July 1, 2021
    Inventor: Xiaopeng Qu
  • Publication number: 20210183843
    Abstract: Semiconductor devices and semiconductor device packages may include at least one first semiconductor die supported on a first side of a substrate. The at least one first semiconductor die may include a first active surface. A second semiconductor die may be supported on a second, opposite side of the substrate. The second semiconductor die may include a second active surface located on a side of the second semiconductor die facing the substrate. The second semiconductor die may be configured to have higher median power consumption than the at least one first semiconductor die during operation. An electronic system incorporating a semiconductor device package is disclosed, as are related methods.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 17, 2021
    Inventors: Shams U. Arifeen, Xiaopeng Qu
  • Patent number: 11011452
    Abstract: A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached to the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: May 18, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Xiaopeng Qu, Amy R. Griffin, Hyunsuk Chun
  • Patent number: 11011449
    Abstract: A semiconductor memory system having a plurality of semiconductor memory modules that are spaced apart from each other by a gap. The system includes a heat dissipation assembly having a thermally conductive base portion configured to transfer heat away from the memory devices. The heat dissipation assembly including at least one cooling unit extending from the base portion. The at least one cooling unit having a wall with an exterior surface and a cavity. The cooling unit is configured to fit in the gap between adjacent memory modules such that a portion of the exterior surface on a first side of the cooling unit is coupled to one of the first memory devices and another portion of the exterior surface on a second side of the cooling unit is coupled to one of the second memory devices across the gap.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: May 18, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Xiaopeng Qu, Shams U. Arifeen
  • Patent number: 10952352
    Abstract: Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: March 16, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Xiaopeng Qu
  • Publication number: 20210055343
    Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes a base portion and a plurality of protrusions extending from the base portion. When the heat spreader is coupled to the burn-in testing board, the protrusions are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.
    Type: Application
    Filed: August 21, 2019
    Publication date: February 25, 2021
    Inventors: Xiaopeng Qu, Amy R. Griffin, Hyunsuk Chun
  • Publication number: 20210055342
    Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.
    Type: Application
    Filed: August 21, 2019
    Publication date: February 25, 2021
    Inventors: Xiaopeng Qu, Amy R. Griffin, Wesley J. Orme
  • Publication number: 20200286805
    Abstract: A heat spreader for use in a memory system is provided, including a thermally conductive body having a first planar side surface and a second planar side surface opposite the first planar side surface, the first planar side surface configured to attach to a first plurality of co-planar semiconductor devices of a first memory module of the memory system, the second planar side surface configured to attach to a second plurality of co-planar semiconductor devices of a second memory module of the memory system, wherein the first planar side surface and the second planar side surface are separated by a body width w substantially equal to a distance between the first plurality of co-planar semiconductor devices and the second plurality of co-planar semiconductor devices.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 10, 2020
    Inventor: Xiaopeng Qu
  • Publication number: 20200176353
    Abstract: A memory system having heat spreaders with different arrangements of projections are provided. In some embodiments, the memory system comprises a substrate, a first semiconductor device attached to a first side of the substrate, a second semiconductor device attached to a second side of the substrate, a first heat spreader attached to the first semiconductor device, and a second heat spreader attached the second semiconductor device. The first heat spreader has a plurality of first projections facing a first direction and positioned in a first arrangement, and the second heat spreader has a plurality of second projections facing a second direction and positioned in a second arrangement different than the first arrangement. In some embodiments, the first projections are aligned with a majority of the second projections in a first direction and are offset with a majority of the second projections in a second direction.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 4, 2020
    Inventors: Xiaopeng Qu, Amy R. Griffin, Hyunsuk Chun
  • Patent number: 10672679
    Abstract: A heat spreader for use in a memory system is provided, including a thermally conductive body having a first planar side surface and a second planar side surface opposite the first planar side surface, the first planar side surface configured to attach to a first plurality of co-planar semiconductor devices of a first memory module of the memory system, the second planar side surface configured to attach to a second plurality of co-planar semiconductor devices of a second memory module of the memory system, wherein the first planar side surface and the second planar side surface are separated by a body width w substantially equal to a distance between the first plurality of co-planar semiconductor devices and the second plurality of co-planar semiconductor devices.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 2, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Xiaopeng Qu
  • Patent number: 10653033
    Abstract: Kits for cooling computing devices may include at least one heat-generating component and a fan. A first duct may be sized and shaped to surround the at least one heat-generating component on three sides to direct a portion of air flow from the fan. A second duct may be sized and shaped to extend over the first duct and direct another portion of air flow between the first and second ducts. The at least one heat-generating component may comprise multiple vertically and longitudinally aligned memory modules Computing devices, electronic systems and methods of cooling are also disclosed.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: May 12, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Xiaopeng Qu, Hyunsuk Chun
  • Publication number: 20200137923
    Abstract: Kits for cooling computing devices may include at least one heat-generating component and a fan. A first duct may be sized and shaped to surround the at least one heat-generating component on three sides to direct a portion of air flow from the fan. A second duct may be sized and shaped to extend over the first duct and direct another portion of air flow between the first and second ducts. The at least one heat-generating component may comprise multiple vertically and longitudinally aligned memory modules Computing devices, electronic systems and methods of cooling are also disclosed.
    Type: Application
    Filed: October 30, 2018
    Publication date: April 30, 2020
    Inventors: Xiaopeng Qu, Hyunsuk Chun
  • Publication number: 20200075451
    Abstract: A heat spreader for use in a memory system is provided, including a thermally conductive body having a first planar side surface and a second planar side surface opposite the first planar side surface, the first planar side surface configured to attach to a first plurality of co-planar semiconductor devices of a first memory module of the memory system, the second planar side surface configured to attach to a second plurality of co-planar semiconductor devices of a second memory module of the memory system, wherein the first planar side surface and the second planar side surface are separated by a body width w substantially equal to a distance between the first plurality of co-planar semiconductor devices and the second plurality of co-planar semiconductor devices.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 5, 2020
    Inventor: Xiaopeng Qu
  • Publication number: 20190132995
    Abstract: Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 2, 2019
    Inventor: Xiaopeng Qu