Patents by Inventor Xiaoqi Zhu
Xiaoqi Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11071862Abstract: There is provided a deep brain stimulation system having k focuses, which comprises: a first electrode and a second electrode, used for connecting one side of a brain scalp; a third electrode and a fourth electrode, used for connecting the other side of the brain scalp; and a first signal generation unit, a second signal generation unit, . . . , a (2k?1)th signal generation unit and a 2kth signal generation unit, wherein the k is a positive integer greater than or equal to 2; and each of the signal generation units is used for providing the following currents for the first electrode to the fourth electrode: a first current and a second current, which are interfered at a deep portion of a brain to form a first focus; and a (2k?1)th current and a 2kth current, which are interfered at the deep portion of the brain to form a kth focus.Type: GrantFiled: December 20, 2018Date of Patent: July 27, 2021Assignee: XI'AN JIAOTONG UNIVERSITYInventors: Jue Wang, Xiaoqi Zhu, Zi-Gang Huang, Youjun Li, Liang Zheng, Tian Liu, Bixin Shao, Chenxi Li, Xun Liu, Ziwei Xu, Boya Xu
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Publication number: 20190366088Abstract: The present disclosure discloses a deep brain stimulation system having k focuses, which comprises: a first electrode and a second electrode, used for connecting one side of a brain scalp; a third electrode and a fourth electrode, used for connecting the other side of the brain scalp; and a first signal generation unit, a second signal generation unit, . . . , a (2k?1)th signal generation unit and a 2kth signal generation unit, wherein the k is a positive integer greater than or equal to 2; and each of the signal generation units is used for providing the following currents for the first electrode to the fourth electrode: a first current and a second current, which are interfered at a deep portion of a brain to form a first focus; and a (2k?1)th current and a 2kth current, which are interfered at the deep portion of the brain to form a kth focus; for the first current, the second current, . . .Type: ApplicationFiled: December 20, 2018Publication date: December 5, 2019Inventors: Jue WANG, Xiaoqi ZHU, Zi-Gang HUANG, Youjun LI, Liang ZHENG, Tian LIU, Bixin SHAO, Chenxi LI, Xun LIU, Ziwei Xu, Boya Xu
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Patent number: 7217994Abstract: A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in electrical communication with corresponding contacts on the ASIC and a second, substantially opposite surface including contacts arranged in electrical communication with corresponding contacts on a PCB. The at least one memory chip is dimensioned to fit within a cutout section in the interposer.Type: GrantFiled: December 1, 2004Date of Patent: May 15, 2007Assignee: Kyocera Wireless Corp.Inventors: Sherry Xiaoqi Zhu, Cam T. Nguyen
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Patent number: 7151010Abstract: Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.Type: GrantFiled: February 4, 2005Date of Patent: December 19, 2006Assignee: Kyocera Wireless Corp.Inventors: Cam T. Nguyen, Sherry Xiaoqi Zhu
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Publication number: 20050218517Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and precoated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: ApplicationFiled: May 28, 2004Publication date: October 6, 2005Applicant: M.A. CapoteInventors: Miguel Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6774493Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: March 19, 2003Date of Patent: August 10, 2004Assignee: M. A. CapoteInventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Publication number: 20030218261Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: ApplicationFiled: March 19, 2003Publication date: November 27, 2003Applicant: M. A. CapoteInventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6566234Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: September 15, 2000Date of Patent: May 20, 2003Assignee: Aguila Technologies, Inc.Inventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6518677Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: September 15, 2000Date of Patent: February 11, 2003Inventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou
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Patent number: 6399426Abstract: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.Type: GrantFiled: September 7, 2001Date of Patent: June 4, 2002Inventors: Miguel Albert Capote, Xiaoqi Zhu, Robert Vinson Burress, Yong-Joon Lee
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Publication number: 20020031868Abstract: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.Type: ApplicationFiled: September 7, 2001Publication date: March 14, 2002Inventors: Miguel Albert Capote, Xiaoqi Zhu, Robert Vinson Burress, Yong-Joon Lee
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Publication number: 20020014703Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness.Type: ApplicationFiled: August 20, 2001Publication date: February 7, 2002Inventors: Miguel A. Capote, Xiaoqi Zhu
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Patent number: 6335571Abstract: A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.Type: GrantFiled: March 2, 2000Date of Patent: January 1, 2002Assignee: Miguel Albert CapoteInventors: Miguel Albert Capote, Xiaoqi Zhu, Robert Vinson Burress, Yong-Joon Lee
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Patent number: 6297560Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness.Type: GrantFiled: August 21, 1998Date of Patent: October 2, 2001Inventors: Miguel A. Capote, Xiaoqi Zhu
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Patent number: 6121689Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction.Type: GrantFiled: July 21, 1998Date of Patent: September 19, 2000Assignee: Miguel Albert CapoteInventors: Miguel A. Capote, Zhiming Zhou, Xiaoqi Zhu, Ligui Zhou