Abstract: The present disclosure provides an electronic apparatus and a method for producing a housing, which relate to a technical field of electronics. The electronic apparatus comprises: a housing comprising a side wall forming an accommodating space and having an outer surface which is divided into K appearance layers, where K is a positive integer greater than or equal to 3, and wherein borderlines between adjacent layers in the K appearance layers are parallel to each other.

Abstract: A flexible device is provided according to the present application, which includes a first sliding shaft, a second sliding shaft, a middle sliding shaft group and a connecting member group. The middle sliding shaft group includes multiple middle sliding shafts arranged in rows. The middle sliding shaft group is movably connected to the first sliding shaft and the second sliding shaft by the connecting member group. The flexible device can be bent along an extending direction of the middle sliding shaft group, and a bent portion of the flexible device is always of an arc-shaped structure. The flexible device according to the present application adopts a mechanical structure to realize a bending deformation thus can avoid problems of a degraded bending performance and breakage generated after the flexible device is frequently used in the conventional technology. An electronic device employing the flexible device is further provided.

Abstract: The present application discloses a bendable structure for an electronic device, which includes a first structural layer and a second structural layer arranged to be overlapped with the first structural layer. The bendable structure has a straight state and a bent state, the first structural layer has a first bendable section which can be bent, and the second structural layer has a second bendable section which can be bent. The first bendable section corresponds to the second bendable section in an overlapped manner. When the bendable structure is in the bent state, a central angle corresponding to the first bendable section and a central angle corresponding to the second bendable section are same, such that both ends of the first bendable section are flush with corresponding ends of the second bendable section.

Abstract: The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing.

Abstract: The present disclosure provides an electronic apparatus and a method for producing a housing, which relate to a technical field of electronics. The electronic apparatus comprises: a housing comprising a side wall forming an accommodating space and having an outer surface which is divided into K appearance layers, where K is a positive integer greater than or equal to 3, and wherein borderlines between adjacent layers in the K appearance layers are parallel to each other.

Abstract: The present disclosure provides an electronic apparatus and a method for producing a housing, which relate to a technical field of electronics. The electronic apparatus comprises: a housing comprising a side wall forming an accommodating space and having an outer surface which is divided into K appearance layers, where K is a positive integer greater than or equal to 3, and wherein borderlines between adjacent layers in the K appearance layers are parallel to each other.

Abstract: One embodiment provides an electronic device, including: a first body; a second body; a first connector configured to couple to the first body of the electronic device; a second connector configured to couple to the second body of the electronic device; and a linkage assembly coupled to the first and second connectors, wherein the linkage assembly comprises a plurality of first linkages configured to couple with respective ones of the first and second connectors, and an intermediate linkage configured to couple to the first linkages, such that a rotation of the first connector along a direction causes a motion of the intermediate linkage which correspondingly rotates the second connector along an opposite direction. Other aspects are described and claimed.

Abstract: A flexible device is provided according to the present application, which includes a first sliding shaft, a second sliding shaft, a middle sliding shaft group and a connecting member group. The middle sliding shaft group includes multiple middle sliding shafts arranged in rows. The middle sliding shaft group is movably connected to the first sliding shaft and the second sliding shaft by the connecting member group. The flexible device can be bent along an extending direction of the middle sliding shaft group, and a bent portion of the flexible device is always of an arc-shaped structure. The flexible device according to the present application adopts a mechanical structure to realize a bending deformation thus can avoid problems of a degraded bending performance and breakage generated after the flexible device is frequently used in the conventional technology. An electronic device employing the flexible device is further provided.

Abstract: The present application discloses a bendable structure for an electronic device, which includes a first structural layer and a second structural layer arranged to be overlapped with the first structural layer. The bendable structure has a straight state and a bent state, the first structural layer has a first bendable section which can be bent, and the second structural layer has a second bendable section which can be bent. The first bendable section corresponds to the second bendable section in an overlapped manner. When the bendable structure is in the bent state, a central angle corresponding to the first bendable section and a central angle corresponding to the second bendable section are same, such that both ends of the first bendable section are flush with corresponding ends of the second bendable section.

Abstract: Embodiments of the present application provide an electronic device and a method of manufacturing a housing for the electronic device, which belong to a field of electronic product. The electronic device comprises a housing and an antenna. The housing comprises N layers each of which is made of a first fiber material and a second fiber material; and the housing comprises a first region, and a second region made of the second fiber material.

Abstract: A coordinated processing method and system for northbound data configuration and self-organized network configuration, the method includes: a northbound configuration module sending a data configuration request and an SON function management module sending a parameter optimization request to a conflict resolution module; the conflict resolution module receiving the requests, and if judging that the parameter requested by the northbound configuration module to be configured conflicts with the parameter requested by the SON function management module to be configured, then sending a conflict judgment message indicating conflict to the northbound configuration module and the SON function management module; after receiving the message, the northbound configuration module performing data configuration in the data configuration request and reporting conflict information to a superior network management; after receiving the message, the SON function management module notifying the SON function module to perform para

Abstract: The present disclosure provides an electronic apparatus and a method for producing a housing, which relate to a technical field of electronics. The electronic apparatus comprises: a housing comprising a side wall forming an accommodating space and having an outer surface which is divided into K appearance layers, where K is a positive integer greater than or equal to 3, and wherein borderlines between adjacent layers in the K appearance layers are parallel to each other.

Abstract: The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing.

Abstract: A coordinated processing method and system for northbound data configuration and self-organized network configuration, the method includes: a northbound configuration module sending a data configuration request and an SON function management module sending a parameter optimization request to a conflict resolution module; the conflict resolution module receiving the requests, and if judging that the parameter requested by the northbound configuration module to be configured conflicts with the parameter requested by the SON function management module to be configured, then sending a conflict judgment message indicating conflict to the northbound configuration module and the SON function management module; after receiving the message, the northbound configuration module performing data configuration in the data configuration request and reporting conflict information to a superior network management; after receiving the message, the SON function management module notifying the SON function module to perform para