Abstract: The present disclosure provides a chip packaging method and a chip packaging structure. The chip packaging method includes: providing an encapsulated grain and a packaging substrate, the encapsulated grain including a first hybrid bonding structure; wherein the packaging substrate includes a front side and a back side opposite to each other; a second hybrid bonding structure is formed on the front side of the packaging substrate and a connection pin is formed on the back side of the packing substrate; the second hybrid bonding structure and the connection pin are electrically connected through a third connecting metal column penetrating the packaging substrate; and bonding together the first hybrid bonding structure of the encapsulated grain and the second hybrid bonding structure of the packaging substrate by medium-to-medium and metal-to-metal aligned bonding such that the encapsulated grain is bonded to the packaging substrate.

Abstract: A method of preparing monopentaerythritol, dipentaerthritol, and sodium formate through high temperature condensation and cascade recrystallization is disclosed. The method lowers the energy consumption dramatically and improves the cost-effectiveness by carrying out the reaction in a non-low-temperature zone, and thereby avoiding the requirement for refrigeration. The method alleviates the difficulty of separation and improves the product quality by means of cascade separation process, and thereby avoiding the low purity from a single separation. In addition, the mother liquor obtained after each separation step is recycled to the previous step as the recycling liquor, which avoids discharging waste, increases the product yield and lowers raw materials consumption.