Abstract: A semiconductor device and a lead frame. The semiconductor device comprises at least one semiconductor chip that is attached to a surface of a base island in a first plane, wherein a connecting rib is connected to the base island, and has a first part which is obliquely connected to the base island; the connecting rib has a second part, and the second part has a surface in a second plane; the second plane is parallel to the first plane and is a plane different from the first plane; the connecting rib has a branch part divided from the second part and the branch part has, in the second plane, a surface used for receiving a lead connected to the semiconductor chip; and the branch part has an edge which is distant from a first edge of the base island by a first distance.

Abstract: A packaging substrate that includes a first conductive layer to an Nth conductive layer stacked in sequence, N being a positive integer greater than 3; an insulating layer arranged between two adjacent conductive layers; a plurality of pads disposed on the first conductive layer, the plurality of pads being used to connect a plurality of conductive bumps at the bottom of a chip; and a plurality of conductive holes arranged one-to-one corresponding to the plurality of pads between the first conductive layer and an ath conductive layer, one end of the conductive hole is connected to the corresponding pad, and the other end extending to the ath conductive layer at most and being electrically connected to a corresponding core conductive hole.

Abstract: A lead frame includes a plurality of lead frame units. An upper surface of each of the plurality of lead frame units includes a soldering region and a non-soldering region outside of the soldering region. The non-soldering region includes a rough surface, and the soldering surface includes no rough surface. Each of the plurality of lead frame units may include a base island and a plurality of pins arranged around the base island, and the soldering region may be arranged on the base island and/or on the plurality of pins. The soldering region my include a wire-bonding soldering portion that connects to a chip via a bonding wire. Each of the plurality of lead frame units may include a plurality of pins, and the soldering region and the non-soldering region are arranged on the plurality of pins.

Abstract: A method and apparatus for pushing network information are provided. The method includes: obtaining browser data uploaded by a browser; classifying the browser data uploaded via a classification model and determining a category of the browser data; obtaining network information related to the category, pushing the network information obtained to the browser.

Abstract: A method and apparatus for pushing network information are provided. The method includes: obtaining browser data uploaded by a browser; classifying the browser data uploaded via a classification model and determining a category of the browser data; obtaining network information related to the category, pushing the network information obtained to the browser.