Patents by Inventor XIAOSHENG SU

XIAOSHENG SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10414136
    Abstract: Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: September 17, 2019
    Assignee: Shengyi Technology Co., Ltd.
    Inventors: Xiaosheng Su, Suwen Ye, Guofang Tang
  • Publication number: 20170354032
    Abstract: Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).
    Type: Application
    Filed: July 6, 2015
    Publication date: December 7, 2017
    Inventors: Xiaosheng SU, Suwen YE, Guofang TANG
  • Publication number: 20160007452
    Abstract: The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.
    Type: Application
    Filed: February 19, 2014
    Publication date: January 7, 2016
    Inventors: Shanyin YAN, Xianping ZENG, Yongjing XU, Zhongqiang YANG, Xiaosheng SU, Li Luo
  • Publication number: 20080279416
    Abstract: A system includes an interface receiving a search and file print and a processing device. The processing device performs a method that includes: performing at least one of a first comparison of quality of the search and file prints to a quality threshold, a second comparison of a minutiae matching score for the search and file prints to a minutiae matching score threshold, and a third comparison of a ridge distance of the search and file prints to a ridge distance threshold; determining that a phase correlation between the search and file prints is to be performed based on results of the at least one of the first, second and third comparisons; aligning the search and file prints and performing the phase correlation to calculate a phase correlation score; and modifying the minutiae matching score based on the calculated phase correlation score.
    Type: Application
    Filed: May 11, 2007
    Publication date: November 13, 2008
    Applicant: MOTOROLA, INC.
    Inventors: PETER Z. LO, XIAOSHENG SU