Patents by Inventor Xiaoshi LI

Xiaoshi LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250352166
    Abstract: A conformable piezoelectric transducer array for performing ultrasound or the like includes a silicone elastomer substrate and a silicone elastomer superstrate. A plurality of piezoelectric transducer elements are disposed between the substrate and superstrate. A first electrical interconnect layer electrically interconnects a first surface of the transducer elements adjacent to the substrate and a second electrical interconnect layer electrically interconnecting a second surface of the transducer elements adjacent to the superstrate.
    Type: Application
    Filed: June 5, 2025
    Publication date: November 20, 2025
    Inventors: Sheng XU, Lin ZHANG, Chonghe WANG, Hongjie HU, Xiaoshi LI
  • Patent number: 12383222
    Abstract: A conformable piezoelectric transducer array for performing ultrasound or the like includes a silicone elastomer substrate and a silicone elastomer superstrate. A plurality of piezoelectric transducer elements are disposed between the substrate and superstrate. A first electrical interconnect layer electrically interconnects a first surface of the transducer elements adjacent to the substrate and a second electrical interconnect layer electrically interconnecting a second surface of the transducer elements adjacent to the superstrate.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: August 12, 2025
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Sheng Xu, Lin Zhang, Chonghe Wang, Hongjie Hu, Xiaoshi Li
  • Publication number: 20190328354
    Abstract: A conformable piezoelectric transducer array for performing ultrasound or the like includes a silicone elastomer substrate and a silicone elastomer superstrate. A plurality of piezoelectric transducer elements are disposed between the substrate and superstrate. A first electrical interconnect layer electrically interconnects a first surface of the transducer elements adjacent to the substrate and a second electrical interconnect layer electrically interconnecting a second surface of the transducer elements adjacent to the superstrate.
    Type: Application
    Filed: January 10, 2018
    Publication date: October 31, 2019
    Inventors: Sheng XU, Lin ZHANG, Chonghe WANG, Hongjie HU, Xiaoshi LI