Patents by Inventor Xiaoshuang ZHENG

Xiaoshuang ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250050318
    Abstract: The present invention relates to a rhodium-free TWC catalytic article, which comprises a catalyst composition coat on a substrate, wherein the catalyst composition coat comprises, —a first region comprising i). a top layer comprising a first platinum component and a first palladium component, each being present in supported form, and ii). a bottom layer comprising a second platinum component in supported form, and—optionally, a second region located downstream of the first region, and comprising iii). a top layer comprising a third platinum component in supported form, and iv). a bottom layer comprising a fourth platinum component in supported form. The present invention relates to an exhaust treatment system comprising the rhodium-free TWC catalytic article.
    Type: Application
    Filed: December 26, 2022
    Publication date: February 13, 2025
    Inventors: Chenghao SUN, Xiaoshuang YANG, Chengwei SONG, Shau Lin CHEN, Gianluca VOLANTE, Xiaolai ZHENG, Markus KINNE
  • Publication number: 20240250093
    Abstract: A display panel includes: a display substrate, including a display region and a peripheral region located outside the display region. The peripheral region includes a bonding region; the display substrate specifically includes a base substrate, a plurality of fanout lines located on one side of the base substrate in the peripheral region and extending to the bonding region, and a plurality of first bonding electrodes electrically connected with the fanout lines in one-to-one correspondence in the bonding region; a drive chip, including a drive chip body and a plurality of pins located on a side of the drive chip body facing the display substrate; wherein the plurality of pins include a plurality of output pins bonded with the first bonding electrodes in one-to-one correspondence.
    Type: Application
    Filed: May 31, 2021
    Publication date: July 25, 2024
    Inventors: Bin WAN, Xiaoyuan WANG, Junhui WU, Junming CHEN, Guodong YANG, Xiaoshuang ZHENG, Zhicheng FAN