Abstract: A container is provided in the present disclosure. The container includes at least one outer wall that is made of a low temperature tolerant material where the at least one outer wall is arranged to substantially form the container with an opening end; a tube that is situated inside the at least one outer wall, where the tube and the at least one outer wall are substantially thermally insulated, and the tube is open at one end that is on a same side of the opening end of the container; and a container cover being shaped substantially to match the at least one outer wall, where the container over is capable of covering the opening end of the container.

Abstract: A container is provided in the present disclosure. The container includes at least one outer wall that is made of a low temperature tolerant material where the at least one outer wall is arranged to substantially form the container with an opening end; a tube that is situated inside the at least one outer wall, where the tube and the at least one outer wall are substantially thermally insulated, and the tube is open at one end that is on a same side of the opening end of the container; and a container cover being shaped substantially to match the at least one outer wall, where the container over is capable of covering the opening end of the container.

Abstract: A semiconductor device manufacturing method includes providing a wafer, which includes a semiconductor substrate, a semiconductor device located on the semiconductor substrate, an interlayer dielectric layer covering the semiconductor device, and a through hole penetrating through the interlayer dielectric layer and a portion of the semiconductor substrate. A metal layer is formed inside the through hole and on a surface of the interlayer dielectric layer. A first planarization process is conducted to remove a portion of the metal layer on the surface of the interlayer dielectric layer. The method also includes conducting an annealing alloy treatment and conducting a second planarization process to completely remove the metal layer on the surface of the interlayer dielectric layer. The manufacturing methods can slowly release stress of the wafer and effectively prevent cracks in silicon vias, thereby reducing TSV leakage problems, thus improving the reliability and yield of the devices.

Abstract: The present disclosure provides conductive plug structures and fabrication methods thereof. An exemplary fabrication process of the conductive plug structure includes providing a substrate; forming a mask layer having an opening on a surface of the substrate; etching the substrate to form a contact hole using the mask layer as an etching mask; etching the mask layer to increase a feature size of the opening; forming an insulation layer on an inner surface of the opening, an inner surface of the enlarged opening and a surface of the mask layer to have more edge corners, a thickness of the insulation layer being greater than a thickness of the remaining mask layer; forming a conductive layer filling the contact hole on the insulation layer; and planarizing the conductive layer and the insulation layer until a surface of the mask layer is exposed.

Abstract: The present disclosure provides conductive plug structures and fabrication methods thereof. An exemplary fabrication process of the conductive plug structure includes providing a substrate; forming a mask layer having an opening on a surface of the substrate; etching the substrate to form a contact hole using the mask layer as an etching mask; etching the mask layer to increase a feature size of the opening; forming an insulation layer on an inner surface of the opening, an inner surface of the enlarged opening and a surface of the mask layer to have more edge corners, a thickness of the insulation layer being greater than a thickness of the remaining mask layer; forming a conductive layer filling the contact hole on the insulation layer; and planarizing the conductive layer and the insulation layer until a surface of the mask layer is exposed.

Abstract: A semiconductor device manufacturing method includes providing a wafer, which includes a semiconductor substrate, a semiconductor device located on the semiconductor substrate, an interlayer dielectric layer covering the semiconductor device, and a through hole penetrating through the interlayer dielectric layer and a portion of the semiconductor substrate. A metal layer is formed inside the through hole and on a surface of the interlayer dielectric layer. A first planarization process is conducted to remove a portion of the metal layer on the surface of the interlayer dielectric layer. The method also includes conducting an annealing alloy treatment and conducting a second planarization process to completely remove the metal layer on the surface of the interlayer dielectric layer. The manufacturing methods can slowly release stress of the wafer and effectively prevent cracks in silicon vias, thereby reducing TSV leakage problems, thus improving the reliability and yield of the devices.

Abstract: The invention relates to a cartridge for ink-jet printer, comprising a cartridge body, a protective cover moving relatively to the cartridge body under pressure, a detection mechanism for cartridge and a detection mechanism for remaining ink volume, wherein the detection mechanism for cartridge includes the first and second detecting units respectively matching to the first and second sensors on the printer. The said second detecting unit includes a shelter unit, a fixed shaft set on the cartridge body, a sliding shaft on the protective cover and a reset unit of the shelter unit, wherein the shelter unit connects with the rotating shaft of the fixed shaft, rotates around the fixed shaft under the pressure of the sliding shaft and resets together with the protective cover under the effect of the reset unit of the shelter unit.

Abstract: The invention relates to a cartridge for ink-jet printer, comprising a cartridge body, a protective cover moving relatively to the cartridge body under pressure and a detection mechanism for cartridge and remaining ink volume, wherein the detection mechanism for cartridge and remaining ink volume includes the first and second detecting members respectively matching to the first and second sensors on the printer as well as a soft support cap set on the cartridge body and communicating to the ink storage chamber, of which the said second detecting member includes a movable lever, a fixed shaft set on the cartridge body, and a position adjustment member for the movable lever set on the protective cover. The said movable lever is connected with the rotating shaft of the cartridge body through the fixed shaft.

Abstract: An ink cartridge for an inkjet printer is provided. The ink cartridge includes a light detection portion, a first triangular prism and a second triangular prism, made of transparent material and disposed on the light detection portion, for receiving, deflecting, or refracting light emitted by a light emitting element on the printer. Two surfaces of the second triangular prism contact ink in the ink cartridge. When the ink cartridge has ink contained therein and is installed into a printer, the light emitted by the light emitting element is totally reflected by the first triangular prism and refracted by the second triangular prism into the ink, and will not be received by a light receiving element on the printer. When the ink in the ink cartridge is exhausted, the light is totally reflected by the second triangular prism onto the first triangular prism, and then is reflected onto the light receiving element, and thus the printer detects that the ink is exhausted.

Abstract: The invention relates to a cartridge for ink-jet printer, comprising a cartridge body, a protective cover moving relatively to the cartridge body under pressure and a detection mechanism for cartridge and remaining ink volume, wherein the detection mechanism for cartridge and remaining ink volume includes the first and second detecting members respectively matching to the first and second sensors on the printer as well as a soft support cap set on the cartridge body and communicating to the ink storage chamber, of which the said second detecting member includes a movable lever, a fixed shaft set on the cartridge body, and a position adjustment member for the movable lever set on the protective cover. The said movable lever is connected with the rotating shaft of the cartridge body through the fixed shaft.

Abstract: The invention relates to a cartridge for ink-jet printer, comprising a cartridge body, a protective cover moving relatively to the cartridge body under pressure, a detection mechanism for cartridge and a detection mechanism for remaining ink volume, wherein the detection mechanism for cartridge includes the first and second detecting units respectively matching to the first and second sensors on the printer. The said second detecting unit includes a shelter unit, a fixed shaft set on the cartridge body, a sliding shaft on the protective cover and a reset unit of the shelter unit, wherein the shelter unit connects with the rotating shaft of the fixed shaft, rotates around the fixed shaft under the pressure of the sliding shaft and resets together with the protective cover under the effect of the reset unit of the shelter unit.

Abstract: An ink cartridge for an inkjet printer is provided. The ink cartridge includes a light detection portion, a first triangular prism and a second triangular prism, made of transparent material and disposed on the light detection portion, for receiving, deflecting, or refracting light emitted by a light emitting element on the printer. Two surfaces of the second triangular prism contact ink in the ink cartridge. When the ink cartridge has ink contained therein and is installed into a printer, the light emitted by the light emitting element is totally reflected by the first triangular prism and refracted by the second triangular prism into the ink, and will not be received by a light receiving element on the printer. When the ink in the ink cartridge is exhausted, the light is totally reflected by the second triangular prism onto the first triangular prism, and then is reflected onto the light receiving element, and thus the printer detects that the ink is exhausted.