Abstract: A semiconductor device includes an ultrathin controller die. In embodiments, a semiconductor die is be mounted on a substrate. The die may be thinned by backgrinding before being mounted on the substrate. Thereafter, a protective coating is applied to the die and substrate, and the protective coating is processed to expose an upper, inactive surface of the die. The die is then thinned by a plasma etching process to partially or completely remove the inactive silicon layer of the die. Thereafter, the protective coating may be removed leaving only the ultrathin die on the substrate. In some embodiments, the die is a memory controller die.

Abstract: An annular structure for an electronic flame off (EFO) wand of a wire bonder is positioned beneath a capillary of the wire bonder. The annular structure provides uniform heat to a bond wire extending from the capillary to form a free air ball (FAB). Because heat is uniformly applied to the bond wire, the FAB is uniformly formed and is centered with respect to the capillary. The FAB is then bonded to a bond pad of a substrate. Because the FAB was uniformly formed and is centered on the capillary, the FAB will also be centered on the bond pad.

Abstract: An earphone includes a housing provided with an accommodating groove and an opening groove. The opening groove connects the accommodating groove and the outside of the housing. A first hole is formed in the groove bottom of the accommodating groove. The earphone further includes an ear hanger, wherein one end of the ear hanger is provided with a rotating part inserted into the accommodating groove through the opening groove. The rotating part is provided with a second hole, a rotating shaft passes through the second hole and inserted into the first hole. The housing and the rotating part are rotatably connected around the rotating shaft. The earphone can effectively solve the problem that the rotating shaft of an existing ear-hanging earphone is prone to radial deflection, and is beneficial to enhancing the use hand feeling of a user.

Abstract: An annular structure for an electronic flame off (EFO) wand of a wire bonder is positioned beneath a capillary of the wire bonder. The annular structure provides uniform heat to a bond wire extending from the capillary to form a free air ball (FAB). Because heat is uniformly applied to the bond wire, the FAB is uniformly formed and is centered with respect to the capillary. The FAB is then bonded to a bond pad of a substrate. Because the FAB was uniformly formed and is centered on the capillary, the FAB will also be centered on the bond pad.

Abstract: An earphone includes a housing provided with an accommodating groove and an opening groove. The opening groove connects the accommodating groove and the outside of the housing. A first hole is formed in the groove bottom of the accommodating groove. The earphone further includes an ear hanger, wherein one end of the ear hanger is provided with a rotating part inserted into the accommodating groove through the opening groove. The rotating part is provided with a second hole, a rotating shaft passes through the second hole and inserted into the first hole. The housing and the rotating part are rotatably connected around the rotating shaft. The earphone can effectively solve the problem that the rotating shaft of an existing ear-hanging earphone is prone to radial deflection, and is beneficial to enhancing the use hand feeling of a user.