Abstract: Provided is a synchronizing mechanism of a hinge of an infolding flexible screen of a mobile terminal. The hinge comprises a left rotating bracket, a right rotating bracket, and a middle mounting frame, wherein the left rotating bracket and the right rotating bracket are respectively connected to the middle mounting frame via a rotating connecting structure, and axes of the left rotating bracket and the right rotating bracket are not on the same line but are parallel to each other, and the synchronizing mechanism comprises a horizontally arranged intermediate gear having an axis perpendicular to the axes of the left rotating bracket and the right rotating bracket, and the left rotating bracket and the right rotating bracket are connected to the intermediate gear via gears or racks, so that the left rotating bracket and the right rotating bracket rotate synchronously and reversely. The position of the intermediate gear is lower than the top of the middle mounting frame.

Abstract: Provided is a synchronizing mechanism of a hinge of an infolding flexible screen of a mobile terminal. The hinge comprises a left rotating bracket, a right rotating bracket, and a middle mounting frame, wherein the left rotating bracket and the right rotating bracket are respectively connected to the middle mounting frame via a rotating connecting structure, and axes of the left rotating bracket and the right rotating bracket are not on the same line but are parallel to each other, and the synchronizing mechanism comprises a horizontally arranged intermediate gear having an axis perpendicular to the axes of the left rotating bracket and the right rotating bracket, and the left rotating bracket and the right rotating bracket are connected to the intermediate gear via gears or racks, so that the left rotating bracket and the right rotating bracket rotate synchronously and reversely. The position of the intermediate gear is lower than the top of the middle mounting frame.

Abstract: The invention relates to chemical mechanical polishing of substrates using an abrasive and a fluid composition, wherein certain organosulfonic acid compounds are used as oxidizers, and particularly relates to a method of polishing substrates comprising copper, tungsten, titanium, and/or polysilicon using a chemical-mechanical polishing system comprising organosulfonic acids having an electrochemical oxidation potential greater than 0.2V as an oxidizer.

Abstract: The present invention relates to the use of ozone (O3) as a reagent in chemical mechanical planarization either in aqueous solution or as a gas directly impinging on the surface to be planarized. An aqueous solution containing ozone may optionally contain abrasive particles and/or additional CMP reagents co-dissolved with the ozone including carbonate and bicarbonate anions, and organic acids such as formic, oxalic, acetic and glycol. Abrasives that may be added include alumina, silica, spinel, ceria, zirconia. Typical concentrations of ozone aqueous solution are in the range from approximately 1 part-per-million up to saturation. Ammonium salts, particularly ammonium carbonate facilitate planarization in cooperation with ozone-containing aqueous solution. Low k dielectric materials, organic as well as inorganic, and difficult to oxidize metals can be planarized with ozone reagents pursuant to the present invention.

Abstract: The present invention relates to the use of ozone (O3) as a reagent in chemical mechanical planarization either in aqueous solution or as a gas directly impinging on the surface to be planarized. An aqueous solution containing ozone may optionally contain abrasive particles and/or additional CMP reagents co-dissolved with the ozone including carbonate and bicarbonate anions, and organic acids such as formic, oxalic, acetic and glycol. Abrasives that may be added include alumina, silica, spinel, ceria, zirconia. Typical concentrations of ozone aqueous solution are in the range from approximately 1 part-per-million up to saturation. Ammonium salts, particularly ammonium carbonate, facilitate planarization in cooperation with ozone-containing aqueous solution. Low k dielectric materials, organic as well as inorganic, and difficult to oxidize metals can be planarized with ozone reagents pursuant to the present invention.

Abstract: The present invention relates to the use of ozone (O3) as a reagent in chemical mechanical planarization either in aqueous solution or as a gas directly impinging on the surface to be planarized. An aqueous solution containing ozone may optionally contain abrasive particles and/or additional CMP reagents co-dissolved with the ozone including carbonate and bicarbonate anions, and organic acids such as formic, oxalic, acetic and glycol. Abrasives that may be added include alumina, silica, spinel, ceria, zirconia. Typical concentrations of ozone aqueous solution are in the range from approximately 1 part-per-million up to saturation. Ammonium salts, particularly ammonium carbonate facilitate planarization in cooperation with ozone-containing aqueous solution. Low k dielectric materials, organic as well as inorganic, and difficult to oxidize metals can be planarized with ozone reagents pursuant to the present invention.