Abstract: A production device for preparing a building material using a fine particle silt in iron tailings includes an operation desk and a grinding device. During movement of edge plates, gears are located inside a side groove and keep meshing with toothed grooves, the edge plates will drive various gears to rotate along a same direction and drive grinding balls and connecting shafts to rotate while moving, the grinding balls will perform grinding treatment on the fine particle silt at the inner end of the grinding cabinet while rotating.

Abstract: In various aspects, the present disclosure provides a method of manufacturing an electrode for an electrochemical cell. The method includes contacting a solid electrode material and a substrate at an interface. The method further includes preparing a liquid electrode material at the interface by heating at least a portion of the solid electrode material to a first temperature. The first temperature is greater than or equal to a melting point of the solid electrode material. The method further includes creating a layer of the liquid electrode material on the substrate by moving at least one of the solid electrode material and the substrate with respect to the other of the solid electrode material and the substrate. The method further includes forming the electrode by cooling the liquid electrode material to a second temperature. The second temperature is less than or equal to the melting point.

Abstract: This disclosure discloses a power adapter and an electronic device system, and relates to the field of heat dissipation technologies. The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing. The printed circuit board assembly is fastened in the housing, and the insulation powder is used to conduct heat generated by the printed circuit board assembly to the housing. Compared with a thermally conductive adhesive, the insulation powder does not have a problem of poor fluidity, and can more easily be sufficiently filled. This solution improves heat dissipation effect of the power adapter and helps further increase a charging power of the power adapter.

Abstract: A method for manufacturing a high-heat-dissipation mixed substrate includes: preparing a mother substrate, the mother substrate including an insulating layer and a temporary carrier plate which are laminated; arranging a plurality of first grooves and a plurality of first cavities on the mother substrate; filling the first groove with a thermally-conductive material to form a first thermally-conductive block, and adhering an embedded device in the first cavity and filling the first cavity with the thermally-conductive material to form a second thermally-conductive block; removing the temporary carrier plate to obtain a semi-finished substrate; manufacturing circuit layers on two opposite side surfaces of the semi-finished substrate to obtain a target mother substrate; and cutting the target mother substrate along region dividing lines to obtain a mixed substrate with a side surface being a thermally-conductive surface.

Abstract: A reasonable millisecond time control method for excavation blasting of a tunnel is provided, and includes: acquiring physical mechanical parameters to establish a millisecond blasting model, and designing four dimensions blasting parameters of explosive quantity, hole number, inter-hole millisecond and inter-row millisecond; simulating, based on the millisecond blasting model, a blasting process of an explosive package using blasting parameters to obtain a blasting vibration curve; obtaining single-hole blasting vibration waveforms, solving a vibration synthesis curve through a vibration synthesis theory; comparing the vibration synthesis curve with the blasting vibration curve to obtain a coupling relationship of blasting parameters; determining a target group of explosive quantity and hole numbers, determining a target millisecond through the coupling relationship of blasting parameters, and relating a millisecond blasting control strategy to control, and it is used for tunneling project to reduce cut blas

Abstract: A liquid circulating cooling package substrate includes a circulating cooling structure including a cooling chamber in a first dielectric layer to expose a heat dissipation face, a metal heat dissipation layer on the inner surface of the cooling chamber, an upright support column formed on a metal heat dissipation layer, and a cooling cover supported on the support column to close the cooling chamber along the periphery of the cooling chamber. The metal heat dissipation layer completely covers the heat dissipation face and the inner side surface of the cooling chamber, and a liquid inlet and a liquid outlet are formed on the cooling cover. A circulating cooling structure is provided in the first dielectric layer, and the circulating cooling structure is formed during the processing of an embedded package substrate such that the processing flow is simple and the cost is low.

Abstract: A manufacturing method for a substrate embedded with integrated inductor includes: providing a bearing plate; manufacturing a first conduction copper column on the bearing plate; arranging a first dielectric layer on the bearing plate which covers the first conduction copper column; opening the first dielectric layer to form a first opening; filling a magnetic material at the first opening; grinding the first dielectric layer so that surfaces of the first conduction copper column and the magnetic material are flush with a surface of the first dielectric layer; removing the bearing plate, etching a metal layer on the surface of the first dielectric layer to form a package substrate; arranging a first circuit layer and a solder mask layer on an upper surface and a lower surface of the package substrate; and forming a window in the solder mask layer corresponding to the first circuit layer.

Abstract: A manufacturing method for a conductive substrate with a filtering function includes preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.

Abstract: A packaging structure includes multiple packaging units, and the packaging units include a hard plate region, a winding region, and a fan-out region. In the packaging structure, the hard plate region of the packaging unit is arranged in a stacked manner, some or all of the fan-out regions are packaged with a chip, and some or all of the fan-out regions packaged with a chip are stacked with the hard plate regions after being bent by the winding region. So designed, each fan-out region is individually packaged and then packaged by stacking with each other to achieve the interconnections between a chip and a chip, and between a chip and a substrate without interference between the packaging units.

Abstract: An embedded inductance structure includes an insulating layer, an inductance located in the insulating layer, a multi-layer conducting circuit located in the insulating layer and on the upper surface and lower surface of the insulating layer, and a multi-layer conductive copper column layer located in the insulating layer. The inductance and the multi-layer conducting circuit are conductively connected via the multi-layer conductive copper column layer, and the inductance includes a magnet and an inductance coil in direct contact with the magnet, and the inductance coil is composed of a multi-layer conductive coil and a conductive copper column located between adjacent conductive coils. The multi-layer conductive coils are respectively in a ring shape with a notch and are disconnected at the notch, and the positions of the conductive copper columns located on the upper side and lower of each conductive coil are different in the longitudinal direction.

Abstract: A display panel, a method for manufacturing a display panel, and a display device. The display panel includes: a substrate; and a pixel definition layer located on the substrate. The pixel definition layer includes isolation structures and pixel openings; and a nucleation inhibiting layer including first inhibiting units. A first orthographic projection of each of the first inhibiting units on the pixel definition layer covers corresponding one of the pixel openings in the transitional display area; and common electrodes including a first common electrode and a second common electrode, a second orthographic projection of the first common electrode on the pixel definition layer covers the first display area and at least part of an area except for the first orthographic projections in the transitional display area.

Abstract: A light-transmitting display module. The light-transmitting display module includes: a substrate; a pixel definition layer, located on the substrate and including an isolation structure and at least one pixel opening encircled by the isolation structure; a nucleation inhibiting layer, located on a side of the pixel definition layer facing away from the substrate and including a plurality of inhibiting units, a first orthographic projection of the inhibiting unit on the pixel definition layer covering at least a part of the isolation structure, and at least a part of the inhibiting units being spaced apart from one another; a first common electrode, located on the side of the pixel definition layer facing away from the substrate, a second orthographic projection of the first common electrode on the pixel definition layer covering at least a part of an area other than the first orthographic projection.

Abstract: A handle assembly and a stapler including the same are provided. The handle assembly includes: a first handle, a second handle, a sliding slot disposed on the first handle, a slider slidably disposed in the sliding slot, a second indicator and a first indicator connected to a first end of the second indicator; when the first indicator is rotated in a first direction, a second end of the second indicator is driven to rotate in the first direction and the slider is pushed to move from a first section of the sliding slot to a second section of the sliding slot; when the slider is pressed against the second handle due to rotation of the first handle in a second direction, the second handle is linked with the first handle and the second end of the second indicator is pushed by the slider to rotate in the second direction.

Abstract: The application relates to the technical field of control, and provides an electromagnetic brake control apparatus. The apparatus includes: a power supply management circuit, a first switch circuit, a freewheeling diode and a first control output end and a second control output end used to connect with two ends of an electromagnetic coil of the electromagnetic brake; the power supply management circuit includes: a power supply input end, a first output end and a second output end used to connect with an external power supply; an input end and an output end of the first switch circuit are respectively connected with the first output end and the first control output end, the first switch circuit is configured with a pulse width modulation function; a cathode and an anode of the freewheeling diode are respectively connected with the second output end and the first control output end.

Abstract: A handle assembly and a stapler including the same are provided. The handle assembly includes: an indicator; a first handle and a second handle; a slot and a slider, provided in the first handle, the slider can be actuated by the indicator to move from a first section to a second section of the slot; when the slider in in the first section, the second handle cannot be actuated by the first handle and is in an insurance position; when the slider is in the second section of the slider, and the second handle can be actuated by the first handle to move towards a firing position. Therefore, no matter whether the stapler is ready to be fired or not, the first handle can be pressed by the doctor. However, when the stapler is not ready to be fired, the second handle won't be actuated to fire the stapler.

Abstract: An OLED display substrate, a manufacturing method thereof and a display device are provided. The OLED display substrate includes a TFT array layer, a first electrode, a pixel definition layer, an OEL layer and a second electrode arranged on a base substrate. The pixel definition layer is configured to define a plurality of subpixel regions. A reflection structure surrounds each subpixel region and is capable of reflecting light beams from the OEL layer and beyond an escaping cone in such a manner as to enable at least parts of the light beams to enter the escaping cone.

Abstract: A handle assembly and a stapler including the same are provided. The handle assembly includes a first handle, a second handle, a slot provided in the second handle and a slider slidably located in the slot. When the slider is in the first section of the slot, the first handle and the second handle are not linked; when the slider is in the second section of the slot, the first handle is linked to the second handle and actuates the second handle to move from an insurance position to a firing position. Therefore, only the movement of the second handle can fire the stapler. No matter whether the stapler is ready to be fired or not, the first handle can be pressed by the doctor, while the stapler cannot be fired when the stapler is not ready to be fired.

Abstract: A handle assembly and a surgical stapler including the handle assembly is provided, including a first handle and a second handle, both can rotate around a first pivot pin. Either the first or the second handle is provided with a slider and a sliding slot. When the slider moves from a first section of the sliding slot to a second section, the two handles become linked. The first handle can still be squeezed even if the stapler has not reached the firing position, but the second handle will not rotate and the stapler will not be fired; featured by the design of two torsion springs and two pivot pins, the first and the second handle are pivotally attached and can be rotated around the same rotation center that remains unchanged in both the insurance position and the firing position, rendering an enhanced stapler structure stability and improved operator experience.

Abstract: A roller brush assembly and a cleaning device are provided. The above roller brush assembly is applied in the cleaning device, including: a main roller brush; an electric motor configured to drive the main roller brush to rotate to sweep a surface to be cleaned; and an auxiliary roller brush driven by the main roller brush to rotate and sweep the surface to be cleaned towards the main roller brush.

Abstract: A handle assembly and a stapler including the same are provided. The handle assembly includes: a first handle component and a second handle, a first end of which is rotatably connected with the first handle component. The handle can be divided into a first handle component and a second handle, and a linkage state of the first handle component and the second handle can be controlled by a moving position of a slider which can be returned by action of a compression spring after the slider is free from a force exerted by the indicator, and a position of the compression spring is defined by a first limiting structure of the slider and a second limiting structure of the first handle component.