Abstract: A packaging structure includes multiple packaging units, and the packaging units include a hard plate region, a winding region, and a fan-out region. In the packaging structure, the hard plate region of the packaging unit is arranged in a stacked manner, some or all of the fan-out regions are packaged with a chip, and some or all of the fan-out regions packaged with a chip are stacked with the hard plate regions after being bent by the winding region. So designed, each fan-out region is individually packaged and then packaged by stacking with each other to achieve the interconnections between a chip and a chip, and between a chip and a substrate without interference between the packaging units.

Abstract: An embedded and packaged heat dissipation structure and a manufacturing method therefor, and a semiconductor are disclosed. The method includes: forming a first semi-finished plate; forming a heat dissipation plate based on the first metal layer; manufacturing a heat dissipation copper column on the heat dissipation plate; providing a dielectric layer; laminating a second metal layer on the dielectric layer; partially etching the second metal layer and the dielectric layer to form a microchannel; manufacturing a thin metal layer to enable an inner wall of the microchannel to form an isolation layer with an integrated structure to obtain a second semi-finished plate; manufacturing a first cover layer; and laminating the first cover layer and the second semi-finished plate to connect the first cover layer and the isolation layer in a sealed manner to obtain the embedded and packaged heat dissipation structure.

Abstract: An apparatus for non-contact current and voltage composite measurement includes: a current signal detection device, a voltage signal detection device, a zero-crossing detection circuit, and a control unit. The current signal detection device generates a current-induced electromotive force based on current flowing on the transmission line to be measured when there is current-voltage passing through the transmission line to be measured; the voltage signal detection device generates a voltage-induced electromotive force based on voltage flowing on the transmission line to be measured when there is current-voltage passing through the transmission line to be measured. The zero-crossing detection circuit performs zero-crossing detection on the current-induced electromotive force and the voltage-induced electromotive force to determine the phase difference between them.

Abstract: This application proposes a magnetic coupling coil optimization method. The method comprises: calculating an equivalent magnetic permeability of a magnetic coupling coil based on an air gap length of the magnetic coupling coil; calculating an effective cross-sectional area of the magnetic coupling coil based on the equivalent magnetic permeability and the power of the magnetic coupling coil; calculating a number of turns of the secondary winding of the magnetic coupling coil based on the effective cross-sectional area and the equivalent magnetic permeability; optimizing the magnetic coupling coil based on the number of turns of the secondary winding. The present application can reasonably configure the parameters of the magnetic coupling coil, effectively acquire energy from the power grid to provide stable power for detection or communication equipment in the power grid, and make the magnetic coupling coil more reliable while meeting the power demand.

Abstract: A liquid circulating cooling package substrate includes a circulating cooling structure including a cooling chamber in a first dielectric layer to expose a heat dissipation face, a metal heat dissipation layer on the inner surface of the cooling chamber, an upright support column formed on a metal heat dissipation layer, and a cooling cover supported on the support column to close the cooling chamber along the periphery of the cooling chamber. The metal heat dissipation layer completely covers the heat dissipation face and the inner side surface of the cooling chamber, and a liquid inlet and a liquid outlet are formed on the cooling cover. A circulating cooling structure is provided in the first dielectric layer, and the circulating cooling structure is formed during the processing of an embedded package substrate such that the processing flow is simple and the cost is low.

Abstract: A display system includes at least one signal loading apparatus and at least one display screen. The signal loading apparatus is configured to output a specific signal. The display screen includes a control module, a signal recognition module and a touch module. The control module is electrically connected to the signal recognition module and the touch module. The signal recognition module is configured to receive an input signal and detect whether the input signal includes the specific signal. The control module is configured to control the working state of the touch module according to a detection result of the signal recognition module.

Abstract: A light-transmitting display module. The light-transmitting display module includes: a substrate; a pixel definition layer, located on the substrate and including an isolation structure and at least one pixel opening encircled by the isolation structure; a nucleation inhibiting layer, located on a side of the pixel definition layer facing away from the substrate and including a plurality of inhibiting units, a first orthographic projection of the inhibiting unit on the pixel definition layer covering at least a part of the isolation structure, and at least a part of the inhibiting units being spaced apart from one another; a first common electrode, located on the side of the pixel definition layer facing away from the substrate, a second orthographic projection of the first common electrode on the pixel definition layer covering at least a part of an area other than the first orthographic projection.

Abstract: An embedded inductance structure includes an insulating layer, an inductance located in the insulating layer, a multi-layer conducting circuit located in the insulating layer and on the upper surface and lower surface of the insulating layer, and a multi-layer conductive copper column layer located in the insulating layer. The inductance and the multi-layer conducting circuit are conductively connected via the multi-layer conductive copper column layer, and the inductance includes a magnet and an inductance coil in direct contact with the magnet, and the inductance coil is composed of a multi-layer conductive coil and a conductive copper column located between adjacent conductive coils. The multi-layer conductive coils are respectively in a ring shape with a notch and are disconnected at the notch, and the positions of the conductive copper columns located on the upper side and lower of each conductive coil are different in the longitudinal direction.

Abstract: The present disclosure provides an energy storage container including a box body and one or more dehumidifiers, the box body includes a top cover and a bottom cover arranged relative to each other, and multiple battery clusters are arranged inside the box body, wherein a length and width of each dehumidifier are both greater than a thickness of the dehumidifier, and the dehumidifiers are arranged between a bottom of the multiple battery clusters and the bottom cover, and a thickness direction of the dehumidifiers is aligned with a height direction of the box body.

Abstract: The present application provides an energy storage container including a container body, battery clusters, and a fire-fighting system. The container body includes a top cover and a bottom cover oppositely disposed. The container body is provided with a battery compartment, and the top cover and the bottom cover surround a top portion and a bottom portion of the battery compartment, respectively. The battery clusters are disposed in the battery compartment. The fire-fighting system includes fire-fighting devices uniformly dispersedly arranged among the battery clusters and the top cover.

Abstract: An embedding method and embedded structure for a magnetic transformer, an electronic device and a storage medium are disclosed. The method includes: providing a copper-clad substrate; electroplating on surfaces of the copper-clad substrate to form a coil; laminating prepregs and copper sheets to form a first substrate; drilling the first substrate to define a first and second through hole; filling a magnetic material in the first through holes to form first embedded magnets; forming a metal layer on an inner wall of the second through hole and surfaces of the first substrate; manufacturing conductive pillars and sacrificial blocks; laminating insulating layers; etching the sacrificial block to define cavities; filling a magnetic material in the cavities to form second embedded magnets; and manufacturing a circuit and a solder resist layer on surfaces of the insulating layer to form a package substrate.

Abstract: In a manufacturing method for a packaging structure, a flexible substrate is provided, wherein the flexible substrate includes a hard plate region, a winding region and a fan-out region, a first wiring layer is formed on one side of the flexible substrate, multiple flexible substrates are laminated and bonded in a hard plate region to form a multi-layer stack structure, in a hard plate region of the multi-layer stack structure, a copper pillar is manufactured for interlayer connection, a second wiring layer connected to the copper pillar is manufactured on two sides of the hard plate region, a dielectric material of the multi-layer stack structure is removed on two sides of the winding region and the fan-out region, and a chip is packaged, and after some or all of the fan-out regions are bent through the winding region, the fan-out regions are stacked with the hard plate region.

Abstract: A manufacturing method for a substrate embedded with integrated inductor includes: providing a bearing plate; manufacturing a first conduction copper column on the bearing plate; arranging a first dielectric layer on the bearing plate which covers the first conduction copper column; opening the first dielectric layer to form a first opening; filling a magnetic material at the first opening; grinding the first dielectric layer so that surfaces of the first conduction copper column and the magnetic material are flush with a surface of the first dielectric layer; removing the bearing plate, etching a metal layer on the surface of the first dielectric layer to form a package substrate; arranging a first circuit layer and a solder mask layer on an upper surface and a lower surface of the package substrate; and forming a window in the solder mask layer corresponding to the first circuit layer.

Abstract: The present application discloses a die cutting method and apparatus for an electrode plate. The die cutting method for an electrode plate includes: providing an electrode-plate material. The die cutting unit performs die cutting on the electrode-plate material to produce individual electrode plates, each corresponding to the length of a single battery cell. During the die cutting process, a defect detection unit inspects the electrode-plate material for defects. A mark formed during die cutting indicates the boundary of each electrode plate. When a defect is detected, the system determines the defect's location relative to the current electrode plate being cut. Based on the position of the defect, the die cutting operation on the affected electrode plate is terminated, and die cutting is restarted on a new electrode plate. This approach allows for real-time defect management during continuous production, thereby enhancing yield and reliability of electrode plate manufacturing.

Abstract: A tab detection system and a tab detection method are provided. The tab detection system includes: a control unit; an imaging unit; and a prism device, where the prism device includes: a prism table; a prism unit; and a driving unit, configured to enable the prism unit to move and/or rotate relative to the prism table, where the control unit iteratively performs the following operations until it is determined that a difference between an evaluation parameter of a tab image and a first threshold is not outside a predetermined range: sending a photographing control signal to the imaging unit; calculating the tab image to obtain the evaluation parameter; and in response to determining that the difference between the evaluation parameter and the first threshold is outside the predetermined range, enabling the prism unit to move and/or rotate at a specified step length relative to the prism table.

Abstract: A coating deviation correction method includes acquiring a plurality of first distances and a plurality of second distances, where each of the plurality of first distances is a distance from an edge of a coating region on a first surface of an electrode plate substrate to a reference edge, each of the plurality of second distances is a distance from an edge of a coating region on a second surface of the electrode plate substrate to the reference edge, and the plurality of first distances and the plurality of second distances are obtained by sampling a plurality of times within one sampling period; and determining a target deviation correction amount in a coating process based on the plurality of first distances, the plurality of second distances, and at least one preset deviation correction amount.

Abstract: A conductive substrate with a filtering function is manufactured by a process including preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.

Abstract: Disclosed are a display substrate, a display panel and a display device. The display substrate includes: a base substrate, multiple gate-line groups, multiple data lines, the multiple data line include: first type of data lines and second type of data lines alternately arranged along the first direction; multiple transistors, transistors in the same sub-transistor group are connected with the same gate line, transistors in adjacent sub-transistor groups are connected with different gate lines, and transistors of the same sub-transistor group are connected with different data lines; multiple pins, the multiple pins include: first type of pins and second type of pins alternately arranged along the first direction; two adjacent first type of data lines are connected with a same first type of pin, and adjacent second type of data lines are connected with a same second type of pin.

Abstract: A display panel, a method for manufacturing a display panel, and a display device. The display panel includes: a substrate; and a pixel definition layer located on the substrate. The pixel definition layer includes isolation structures and pixel openings; and a nucleation inhibiting layer including first inhibiting units. A first orthographic projection of each of the first inhibiting units on the pixel definition layer covers corresponding one of the pixel openings in the transitional display area; and common electrodes including a first common electrode and a second common electrode, a second orthographic projection of the first common electrode on the pixel definition layer covers the first display area and at least part of an area except for the first orthographic projections in the transitional display area.