Abstract: A divided-pulse laser regeneration amplification apparatus includes: a signal light coupling component including a first half-wave plate, a first polarization beam splitter, a first Faraday rotator and a second half-wave plate placed in sequence; and a divided-pulse laser regeneration amplification component including a second polarization beam splitter and a third reflector, the second polarization beam splitter is adjacent to the second half-wave plate and is in a same column as the third reflector and the second half-wave plate; a first quarter-wave plate, a Pockels cell and a first reflector are successively arranged on a first side of the second polarization beam splitter, and a third half-wave plate, a first pulse polarization separation component and a first non-linear pulse amplification component are successively arranged on a second side of the second polarization beam splitter.

Abstract: A method for a programmable primitive setup in a 3D graphics pipeline is introduced to contain at least the following steps. Information about first and third primitives is obtained from a buffer. The information about all or a portion of the first primitives is packed and sent to an SS (Setup Shader) thread. Information about a second primitive to be clipped is packed and sent to a GBS (Guard-Band-clipping Shader) thread. The information about all or a portion of the third primitives is packed and sent to an AS (Attribute Shader) thread.

Abstract: A method for a programmable primitive setup in a 3D graphics pipeline is introduced to contain at least the following steps. Information about first and third primitives is obtained from a buffer. The information about all or a portion of the first primitives is packed and sent to an SS (Setup Shader) thread. Information about a second primitive to be clipped is packed and sent to a GBS (Guard-Band-clipping Shader) thread. The information about all or a portion of the third primitives is packed and sent to an AS (Attribute Shader) thread.

Abstract: A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: Optoelectronic packages with one or more feed-throughs having a cutout allow optical fibers that have been coupled to a component (e.g., an optical component, an electrical component, a structural component) to be fed through more easily than a package having feed-throughs without a cutout. In one embodiment, the cut in the feed-through is on the opposite side of the initial direction of the threading. That is, if the fiber is to come from above the feed-through, the cut is placed on the bottom of the feed-through. The placement of the cut on the feed-through allows a fiber previously attached to a component to be fed through without excessive curvature of the fiber.

Abstract: Impedance matching circuits for optical transmitters are disclosed. In one aspect, an impedance matching circuit may include an equalizer circuit, a resistor coupled between the equalizer circuit and ground, and an electro-absorption modulator or other light intensity modulator coupled in series with the equalizer circuit and coupled in parallel with the resistor. In a further aspect, the equalizer circuit may have an impedance that varies with frequency and may include an inductor, and a second resistor that is coupled in parallel with the inductor. Methods of making and using the impedance matching circuits are also disclosed. Optical transmitters, transceivers, and other systems including the impedance matching circuits are also disclosed.

Abstract: A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract: A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.

Abstract: Optoelectronic packages with one or more feed-throughs having a cutout allow optical fibers that have been coupled to a component (e.g., an optical component, an electrical component, a structural component) to be fed through more easily than a package having feed-throughs without a cutout. In one embodiment, the cut in the feed-through is on the opposite side of the initial direction of the threading. That is, if the fiber is to come from above the feed-through, the cut is placed on the bottom of the feed-through. The placement of the cut on the feed-through allows a fiber previously attached to a component to be fed through without excessive curvature of the fiber.

Abstract: A low profile ringframe used in electro-optical module packaging, for being hermetically sealed, e.g., by a solder joint, to a metalized ceramic substrate base, and to which a deep cover is later hermetically sealed, e.g., by a laser weld, the ringframe's side walls being of sufficiently low height to permit computer-aided viewing from the side, as well as top, of the critical optical fiber end-to-laser diode alignment. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-substrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.