Abstract: The present teaching relates to method, system, medium, and implementations for detecting liveness. An input image is received with visual information claimed to represent a palm of a person. One or more variations of the input image are generated based on one or more models specifying conditions to generate the variations. The liveness of the visual information is detected based on the input image and the one or more variations thereof.

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.

Abstract: Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.

Abstract: The present teaching relates to user authentication. Upon a light sensitive sensor detects a motion, an infrared or near infrared sensor may be activated for capturing an image of a body part of a person appearing nearby. The body part may be positioned in a contactless manner with respect to the infrared or near infrared sensor. The image of the body part may be acquired via the infrared or near infrared sensor. Via processing of the image, it may be determined whether the body part being imaged represents an anticipated body part for authentication. If the body part being imaged is determined to be an anticipated body part for authentication, biometric features of the body part may be extracted from the image. Via the extracted biometric features of the body part, it may be verified whether the person corresponds to one of one or more authorized users previously registered.

Abstract: Provided is a biometric information imaging module, used for imaging palm veins, and method of using same. The imaging module includes a housing with a cover attached to a top of the housing; a lens assembly with a lens for taking images provided in the housing; a light shielding structure provided around at least part of the lens of the lens assembly for shielding the lens from light reflected from the cover; and an image sensor to convert light focused by the lens assembly to photoelectric conversion to an electrical signal. The lens assembly is attached to a first circuit board and the light shielding structure is connected to a second circuit board in the housing.

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.

Abstract: A transmission includes first, second, and third planetary gear sets (PGS). A first electric machine is fixedly coupled to a sun gear of the first PGS. A second electric machine is fixedly coupled to a carrier of the first PGS. A brake is selectively holding a ring gear of the first PGS against rotation. First and second clutches selectively couple the first and second electric machines, respectively, to a portion of the second and third PGS, respectively.

Abstract: A transmission includes first, second, and third planetary gear sets (PGS). A first electric machine is fixedly coupled to a sun gear of the first PGS. A second electric machine is fixedly coupled to a carrier of the first PGS. A brake is selectively holding a ring gear of the first PGS against rotation. First and second clutches selectively couple the first and second electric machines, respectively, to a portion of the second and third PGS, respectively.

Abstract: A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.

Abstract: An automatic modeling and screening method capable of exhaustively searching through all configurations with all possible clutch locations and operating modes for a hybrid vehicle. By combining this method with Power-weighted Efficiency Analysis for Rapid Sizing (PEARS), a near-optimal and computationally efficient energy management strategy, it is feasible to search through an extremely large design space of configuration, component sizing and control to identify optimal designs for hybrid power vehicles.

Abstract: In an embodiment, a stack arrangement is provided. The stack arrangement may include a semiconductor arrangement, the semiconductor arrangement including a substrate; a via formed through the substrate; and a conductive portion arranged in the via. The stack arrangement may further include an interconnect portion arranged over the via; a bond pad portion arranged between the semiconductor arrangement and the interconnect portion, the bond pad portion may include a bond pad circumferential portion arranged at least partially circumferential with respect to the via and at a first distance away from the conductive portion; and at least one bond pad electrical connection extending from within the bond pad circumferential portion to the conductive portion; wherein the interconnect portion may be arranged away from the conductive portion via the bond pad portion.

Abstract: A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.

Abstract: According to one embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure includes a first support structure, a plurality of chips formed on the first support structure and a reinforcing structure formed on the first support structure, the reinforcing structure including an outer surrounding element which surrounds the plurality of chips and extends from a surface of the first support structure to a height higher than each of the plurality of chips. A method of manufacturing a semiconductor structure is also provided.

Abstract: According to one embodiment of the present invention, a semiconductor structure is provided. The semiconductor structure includes a first support structure, a plurality of chips formed on the first support structure and a reinforcing structure formed on the first support structure, the reinforcing structure including an outer surrounding element which surrounds the plurality of chips and extends from a surface of the first support structure to a height higher than each of the plurality of chips. A method of manufacturing a semiconductor structure is also provided.

Abstract: Embodiments provide a cooling device. The cooling device comprises a container configured as a heat sink. The container is at least partially made from heat conducting material. The cooling device further comprises endothermic chemical material which is contained in the container.

Abstract: The present invention provides a method for straining a semiconductor wafer, the method comprising: providing a semiconductor wafer, the semiconductor wafer having a first wafer surface and a second wafer surface arranged substantially opposite the first wafer surface; providing a substrate, the substrate having a substrate surface; adhering the first wafer surface to the substrate surface, thereby connecting the semiconductor wafer to the substrate and forming a wafer substrate unit; heating the semiconductor wafer and the substrate to a first temperature; and cooling the wafer substrate unit to a second temperature lower than the first temperature; thereby straining and bending the semiconductor wafer. The present invention further provides a wafer substrate unit.