Patents by Inventor Xiaoxiong Miao

Xiaoxiong Miao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230340239
    Abstract: A polymeric composition includes an ethylene-based polymer and a free radical scavenger having structure (I), wherein, R1 and R2 are independently linear, or branch form alkyl, alkenyl, phenyl or aryl group moieties with or without substituents and each of R1 and R2 have a carbon number from 1 to 100, further wherein the polymeric composition is thermoplastic.
    Type: Application
    Filed: September 29, 2020
    Publication date: October 26, 2023
    Inventors: Chao He, Wenke Miao, Xianmin Xu, Yuming Lai, Mohamed Esseghir, Xiaoxiong Miao
  • Publication number: 20230279196
    Abstract: A polymeric composition includes 90 wt % to 99 wt % of an ethylene-based polymer based on a total weight of the polymeric composition; 0.1 wt % to 1 wt % of a hindered amine light stabilizer based on the total weight of the polymeric composition; and 0.1 wt % to 5.0 wt % of at least one of MgO, Mg (OH)2, ZnO and Zn (OH)2 based on the total weight of the polymeric composition.
    Type: Application
    Filed: September 7, 2020
    Publication date: September 7, 2023
    Inventors: Wenke Miao, Chao He, Xianmin Xu, Yuming Lai, Jing Yu, Mohamed Esseghir, Xiaoxiong Miao
  • Publication number: 20220195232
    Abstract: A cable includes (a) a conductor; and (b) an expanded polymeric coating surrounding at least a portion of the conductor, the expanded polymeric coating including: (i) 70.0 wt. % to 99.8 wt. % low-density polyethylene homopolymer; and (ii) 0.2 wt. % to 5.0 wt. % of expanded polymeric microspheres having a D50 average diameter of from 25 ?m to 40 ?m, wherein the expanded polymeric coating has a density of 0.75 g/cc or less.
    Type: Application
    Filed: July 1, 2019
    Publication date: June 23, 2022
    Inventors: Wenke Miao, Chao He, Xianmin Xu, Mohamed Esseghir, Xiaoxiong Miao
  • Patent number: 10726976
    Abstract: Semiconductive shield layers for power cable constructions are made from a composition that has: (A) A nonpolar, ethylene-based polymer having a density of greater than (>) 0.90 glee and a melt index of >20 g/10 min at 190° C./2.16 Kg; (B) A polar polymer consisting of ethylene and an unsaturated alkyl ester having 4 to 20 carbon atoms; (C) Acetylene carbon black; and (D) A curing agent; with the provisos that (1) the composition has a phase separated structure, and (2) the weight ratio of nonpolar polymer to polar polymer is from 0.25 to 4.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: July 28, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Xiaomei Song, Hongyu Chen, Yabin Sun, Youjun Wu, Wei Li, Xiaoxiong Miao
  • Publication number: 20190156973
    Abstract: Semiconductive shield layers for power cable constructions are made from a composition comprising: (A) A nonpolar, ethylene-based polymer having a density of greater than (>) 0.90 g/cc and a melt index of >20 g/10 min at 190° C./2.16 Kg; (B) A polar polymer consisting of ethylene and an unsaturated alkyl ester having 4 to 20 carbon atoms; (C) Acetylene carbon black; and (D) A curing agent; with the provisos that (1) the composition has a phase separated structure, and (2) the weight ratio of nonpolar polymer to polar polymer is from 0.25 to 4.
    Type: Application
    Filed: June 30, 2016
    Publication date: May 23, 2019
    Inventors: Xiaomei Song, Hongyu Chen, Yabin Sun, Youjun Wu, Wei Li, Xiaoxiong Miao