Abstract: A high-density disk array device can enhance accessing capacity and heat-dissipating capacity, which includes a casing formed with an entry. A pair of disk modules and a pair of fan modules are received in the casing. The pair of disk modules can be drawn from the entry of the casing. Each of the disk modules has a plurality of hard disks received therein in a drawable way, a power module and an input/output module. The pair of fan modules are arranged adjacent to an outer side of the pair of disk modules correspondingly. A central passageway is formed between the pair of disk modules. After the disk module is drawn out from the casing, the hard disks can be drawn along a direction perpendicular to the central passageway.