Abstract: Approaches are described for optimizing solder paste overprint distribution on printed circuit boards (PCBs) using virtual representations within a physics-based simulation environment integrated with cloud-based infrastructure. Solder paste overprint representations may be initialized to correspond to pins and holes in the PCB layout. These virtual representations may expand dynamically in all directions, guided by predefined constraints such as pin boundary limits, collision handling, minimum spacing requirements, and maximum penetration depth to control overlap between neighboring regions. The simulation may iteratively evaluate interactions between expanding regions and apply directional and penetration constraints to maintain separation and prevent interference. Each representation may be assessed for target area completion based on spatial and design conditions.