Abstract: The present disclosure relates to the field of EV-DWPT (electric vehicle dynamic wireless power transfer), and specifically discloses a double solenoid EV-DWPT system and a parameter optimization method thereof. The system is provided with a magnetic coupling mechanism, comprising a transmitting structure and a receiving structure. The transmitting structure includes a plurality of double solenoid transmitting rails arranged equidistantly along a road direction. Each double solenoid transmitting rail includes a square tubular magnetic core perpendicular to the road surface, and transmitting solenoids wound spirally using one and the same Litz wire wound in opposite directions.

Abstract: The present disclosure relates to the field of EV-DWPT (electric vehicle dynamic wireless power transfer), and specifically discloses a double solenoid EV-DWPT system and a parameter optimization method thereof. The system is provided with a magnetic coupling mechanism, comprising a transmitting structure and a receiving structure. The transmitting structure includes a plurality of double solenoid transmitting rails arranged equidistantly along a road direction. Each double solenoid transmitting rail includes a square tubular magnetic core perpendicular to the road surface, and transmitting solenoids wound spirally using one and the same Litz wire wound in opposite directions.

Abstract: Embodiments herein relate to systems, apparatuses, techniques or processes for hybrid bonding a die to a substrate. In embodiments, the die may be a chiplet that is bonded to an interconnect. In embodiments, the die may be a plurality of dies, where the plurality of dies are hybrid bonded to a substrate, to each other, or a combination of both. Other embodiments may be described and/or claimed.

Abstract: A gimbal and a gimbal control method are disclosed. The gimbal control method may include: acquiring attitude information of a gimbal; determining whether the gimbal is in a falling state based upon the attitude information; and when the gimbal is in the falling state, triggering a protection mode and controlling the gimbal to rotate to a set attitude. The set attitude may be an attitude at which the gimbal is not easy to be broken from falling, thereby reducing the probability of the gimbal being broken from falling.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a semiconductor device. In selected examples, the semiconductor device may include two semiconductor dies, a redistribution layer, an interconnect bridge coupled between the two semiconductor dies and located vertically between the two semiconductor dies and the redistribution layer, and a metallic connection passing through the redistribution layer and coupled to one or more of the two semiconductor dies in a solder-free connection.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface with first conductive contacts and an opposing second surface with second conductive contacts, in a first layer; a die attach film (DAF), at the first surface of the first die, including through-DAF vias (TDVs), wherein respective ones of the TDVs are electrically coupled to respective ones of the first conductive contacts; a conductive pillar in the first layer; and a second die, in a second layer on the first layer, wherein the second die is electrically coupled to the second conductive contacts on the second surface of the first die and electrically coupled to the conductive pillar.

Abstract: Disclosed herein are microelectronic assemblies including bridges, as well as related methods. In some embodiments, a microelectronic assembly may include a bridge in a mold material.

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Abstract: A motion sensor module and a movable platform are provided. The motion sensor module may include: a motion sensor; a bearing frame for bearing the motion sensor; a mounting frame for connecting an external mechanism; and a plurality of dampers distributed around the bearing frame. The mounting frame and the bearing frame may be arranged opposite to each other at a distance interval. One end of each damper may be connected to the mounting frame, and the other end of each damper may be connected to the bearing frame. The axial stiffness of each damper may be greater than the radial stiffness thereof, and the axial direction of damper may extend obliquely outwards from the mounting frame.