Patents by Inventor Xiaoying (Janet) He

Xiaoying (Janet) He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11665450
    Abstract: This disclosure describes devices, systems, and methods that relate to obtaining image frames with variable resolutions in synchronization with a clock source. An example device may include an image sensor, a clock input, and a controller. The controller includes at least one processor and a memory. The at least one processor is operable to execute program instructions stored in the memory so as to carry out operations. The operations include receiving, by the clock input, a clock signal. The clock signal is a periodic signal defining at least one scan interval. The operations also include during the scan interval, causing the image sensor to capture a full resolution image frame. The operations yet further include during the scan interval, causing the image sensor to capture at least one reduced resolution image frame.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: May 30, 2023
    Assignee: Waymo LLC
    Inventors: Nirav Dharia, Xiaoying He, Benjamin Frevert
  • Publication number: 20230154935
    Abstract: The present disclosure provides a display substrate, a display panel and a display apparatus, belonging to the field of display technology. The display substrate includes a base, a plurality of common electrodes and a plurality of common electrode lines, the common electrodes are distributed on the base in an array, the common electrode lines extend along a row direction, and each common electrode line is connected to a corresponding row of common electrodes. The common electrode line is connected to the common electrode through a conductive connection portion, and the conductive connection portion includes conductive structures stacked on top of one another in a plurality of layers. The display substrate can reduce the resistance between the common electrode and the common electrode line, thereby reducing the voltage difference between the common electrodes in the display substrate and improving the uniformity of the common voltage therein.
    Type: Application
    Filed: January 19, 2023
    Publication date: May 18, 2023
    Inventors: Xue WANG, Xiao WANG, Yan YAN, Tingting WANG, Yaya QI, Xiaoying LI, Zhiqiang MA
  • Publication number: 20230142243
    Abstract: This disclosure provides a device environment identification method, a device environment identification apparatus, an electronic device and an autonomous vehicle, and relates to the field of artificial intelligence, in particular to the field of autonomous driving technology, sensor technology, etc. The method includes: obtaining data collected by a sensor of a device from an environment where the device is located; extracting feature information from the collected data; and generating an identification result of the environment in accordance with the feature information, the identification result being used for indicating a corresponding relationship between the environment and calibration of the sensor.
    Type: Application
    Filed: December 30, 2022
    Publication date: May 11, 2023
    Applicant: Apollo Intelligent Driving Technology (Beijing) Co., Ltd.
    Inventors: Xitong WANG, Kuang HU, Jinping LIANG, Ming LIN, Kang WANG, Xiaoying CHEN
  • Patent number: 11642293
    Abstract: A composition comprising at least two visually distinguishable phases, comprises at least one fatty phase with oil, at least one aqueous phase with hydrophilic gelling agent, and at least one compound chosen from N,N-dimethylglycine derivatives, alkyl(poly)glucosides, or a mixture thereof.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: May 9, 2023
    Assignee: L'OREAL
    Inventors: Xiaoying Hu, Runshuang Lu, Lingling Sun, Xiuxia Wang
  • Publication number: 20230138689
    Abstract: A captive fastener attachable to a panel along a fastener axis is provided. The captive fastener includes a fastener having a head portion and a shaft extending from the head portion and along the fastener axis. The captive fastener also includes a knob having a proximal end portion engaged to the head portion of the fastener and an annular portion extending radially around the fastener axis and the shaft of the fastener. A ferrule is associated with the knob, the ferrule defining an opening extending along the fastener axis and receiving the shaft of the fastener. The ferrule has a proximal end portion configured to prevent separation of the knob from the ferrule along the fastener axis and a distal end portion configured for engagement to the panel. A spring is positioned to bias the knob or the fastener proximally relative to the ferrule and to inhibit tilting of the knob or the fastener relative to the fastener axis.
    Type: Application
    Filed: April 9, 2021
    Publication date: May 4, 2023
    Applicant: Southco, Inc.
    Inventors: Jingyao Peng, Thomas V. Aukzemas, Xuexian Qin, Richard E. Schlack, Bing Hua Chiang, Chuanjun Li, Xiaoying Liao
  • Publication number: 20230140397
    Abstract: Provided are an anti-PSMA antibody-Exatecan analogue conjugate and medical use thereof. Specifically, provided is an anti-PSMA antibody-drug conjugate represented by general formula (Pc-L-Y-D), wherein Pc is an anti-PSMA antibody or an antigen-binding fragment thereof.
    Type: Application
    Filed: March 25, 2021
    Publication date: May 4, 2023
    Applicants: JIANGSU HENGRUI PHARMACEUTICALS CO., LTD., SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.
    Inventors: Hua YING, Xiaomin ZHANG, Xiaoying YANG, Weikang TAO
  • Publication number: 20230137877
    Abstract: No-remelt solder joints can eliminate die or substrate movement in downstream reflow processes. In one example, one or more solder joints between two substrates can be formed as full IMC (intermetallic compound) solder joints. In one example, a full IMC solder joint includes a continuous layer (e.g., from the top pad to bottom pad) of intermetallic compounds. In one example, a full IMC joint can be formed by dispensing a no-remelt solder paste on some of the pads of one or both substrates to be bonded together.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 4, 2023
    Inventors: Bohan SHAN, Haobo CHEN, Omkar KARHADE, Malavarayan SANKARASUBRAMANIAN, Dingying XU, Gang DUAN, Bai NIE, Xiaoying GUO, Kristof DARMAWIKARTA, Hongxia FENG, Srinivas PIETAMBARAM, Jeremy D. ECTON
  • Patent number: 11640260
    Abstract: A data storage device includes a memory device and a controller coupled to the memory device. The data storage device supports zoned namespace. The controller is configured to maintain a zone timestamp table that includes a corresponding timestamp for each zone and add a timestamp to each garbage collection block of the memory device. The controller is further configured to scan a garbage collection block from a last physical block address (PBA) entry to a first PBA entry, determine a zone timestamp for the scanned PBA entry, and compare the zone timestamp to a timestamp of the garbage collection block. The controller is further configured to create and maintain a zone timestamp table and create and maintain a zone based defragmentation table.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: May 2, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Hongmei Xie, Aajna Karki, Xiaoying Li, Ji-Hyun In, Dhanunjaya Rao Gorrle
  • Publication number: 20230126597
    Abstract: Methods and systems are presented for providing a container orchestration framework for facilitating development and deployment of software applications across different operating environments within an enterprise system. Upon receiving a service request for processing a set of data is received, the container orchestration framework determines one or more machines that store the set of data. Instead of processing the set of data remotely, the container orchestration framework deploys a container that encapsulates an application on the one or more machines. Each application instance running on the one or more machines are executed to process a corresponding subset of data stored on the machine locally. The container orchestration framework obtains the output data from executing the applications on each of the one or more machines, and present the output data as a response to the service request.
    Type: Application
    Filed: August 19, 2022
    Publication date: April 27, 2023
    Inventors: Srinivasan Manoharan, Vinesh Chirakkil, Yuehao Wu, Junhua Zhao, Xiaoying Han, Chun Kiat Ho, Premila Viswanathan, Lin Song
  • Publication number: 20230114120
    Abstract: This application discloses a communication method and apparatus. The method includes: A first access network device receives first uplink data from a terminal device; and sends a request message to a core network device, where the request message requests path switching of user plane data of the terminal device, the request message includes first information, and the first information indicates a first PDU session corresponding to the first uplink data.
    Type: Application
    Filed: December 14, 2022
    Publication date: April 13, 2023
    Inventors: Chunhua You, Xiaoying Xu, Qinghai Zeng
  • Publication number: 20230104014
    Abstract: The present disclosure provides a tablet case, and relates to the technical field of tablet cases. The tablet case includes a case body and a soft rubber side cover; a buckle cover is mounted on a surface of the case body; an insertion slot is formed in an outer side of the case body; an extension plate is fixedly arranged on a surface of the soft rubber side cover; one side of the extension plate is fixedly provided with an insertion rod. In addition, to mount the soft rubber side cover again, the user simply inserts the insertion rod into the insertion slot and can reuse the soft rubber side cover. The whole process is easy and fast, and the tablet case is convenient to use and can meet a use demand of the user.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 6, 2023
    Inventor: Xiaoying Zhan
  • Publication number: 20230107046
    Abstract: Disclosed is a network management system that provides an interface to enable diagnostics and troubleshoot of a remotely managed multi-site network. Some embodiments provide a natural language interface, while other embodiments provide a chatbot type interface that communicates with a technician via traditional text information on a display screen. The diagnostic and troubleshooting capabilities search a central data store that receives device property information from each site of the multi-site network. Based on devices or users that match portions of the entity, queries to the data store are initiated to obtain additional data on the devices. A response to the query is then provided based on the properties of the devices.
    Type: Application
    Filed: October 28, 2022
    Publication date: April 6, 2023
    Inventors: Xiaoying Wu, Jisheng Wang, Amin Toghi Eshghi
  • Publication number: 20230097624
    Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes an array of bumps to electrically couple the die to the substrate. Each of the bumps have a corresponding base. Different ones of the bases have different widths that vary spatially across the array of bumps.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Kyle McElhinny, Onur Ozkan, Ali Lehaf, Xiaoying Guo, Steve Cho, Leonel Arana, Jung Kyu Han, Srinivas Pietambaram, Sashi Kandanur, Alexander Aguinaga
  • Publication number: 20230101629
    Abstract: Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Hongxia Feng, Gang Duan, Jung Kyu Han, Xiaoying Guo, Jeremy D. Ecton, Santosh Tripathi, Bai Nie, Haobo Chen, Kyle Jordan Arrington, Yue Deng, Wei Wei
  • Publication number: 20230095281
    Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes bumps to electrically couple the die to the substrate. Ones of the bumps have corresponding bases. The bases have a shape that is non-circular.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han, Changhua Liu, Leonel Arana, Rahul Manepalli, Dingying Xu, Amram Eitan
  • Publication number: 20230096835
    Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes operational bridge bumps to electrically connect the die to a bridge within the substrate. The apparatus also includes dummy bumps adjacent the operational bridge bumps.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Kyle McElhinny, Bohan Shan, Hongxia Feng, Xiaoying Guo, Adam Schmitt, Jacob Vehonsky, Steve Cho, Leonel Arana
  • Publication number: 20230098013
    Abstract: Systems, apparatus and method for wireless communication are described. One example method for wireless communication includes determining, by a wireless device, to perform a control channel skipping behavior mode for monitoring a control channel; and monitoring, by the wireless device, subsequent to the determining, the control channels according to the control channel skipping behavior mode.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 30, 2023
    Inventors: Xiaoying Ma, Qiujin Guo, Jun Xu, Mengzhu Chen, Xuan Ma, Focai Peng
  • Publication number: 20230087310
    Abstract: Methods, systems and apparatus for wireless communication are described. One example method of wireless communication includes selecting, by a wireless device, a monitoring behavior for monitoring a control channel. The method further includes, monitoring, by the wireless device, the control channel according to the monitoring behavior. The monitoring behavior may include a skipping operation during which monitoring is disabled.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 23, 2023
    Inventors: Qiujin Guo, Xiaoying Ma, Mengzhu Chen, Jun Xu, Focai Peng, Xuan Ma
  • Patent number: D986121
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: May 16, 2023
    Inventor: Xiaoying Li
  • Patent number: D986447
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: May 16, 2023
    Inventor: Xiaoying He