Patents by Inventor Xiaoying REN

Xiaoying REN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND PRINTED CIRCUIT BOARD PREPARATION METHOD
    Publication number: 20260075714
    Abstract: There are provided an electronic device, a printed circuit board, and a method for preparing a printed circuit board. The printed circuit board includes a layer structure body, a transmission line for transmitting signals, and at least two metallized through holes penetrating through the layer structure body, the transmission line is located in the layer structure body, and has two ends directly connected to walls of two metallized through holes, respectively.
    Type: Application
    Filed: July 31, 2023
    Publication date: March 12, 2026
    Inventors: Jian XIE, Zhongmin WEI, Xiaoying REN
  • VIA HOLE STRUCTURE OF CIRCUIT BOARD, AND CIRCUIT BOARD
    Publication number: 20260059652
    Abstract: Provided in the present disclosure are a via hole structure of a circuit board, and a circuit board. The via hole structure comprises at least one pair of differential signal holes, wherein each pair of differential signal holes comprises a first differential signal hole and a second differential signal hole. In a thickness direction of the circuit board, there are several distances between the central axis of the first differential signal hole and the central axis of the second differential signal hole, and numerical values of at least two distances are different.
    Type: Application
    Filed: January 29, 2023
    Publication date: February 26, 2026
    Inventors: Xiaoying REN, Jinlong LI, Zhongmin WEI, Xin KANG