Abstract: A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.

Abstract: A variable distributed constant line includes a substrate, a signal line that is provided on the substrate, and includes a first line portion and a second line portion facing each other, a movable electrode that is provided above the substrate, and straddles both the first line portion and the second line portion in a manner to face the first line portion and the second line portion, and a driving electrode that is provided on the substrate in a manner to face the movable electrode, attracts the movable electrode by an action of a voltage applied between the driving electrode and the movable electrode, and changes a distance between the signal line and the movable electrode.

Abstract: The present invention discloses a control method for the system gain of a UPS, which includes the steps of: S1: detecting a PFC unit so as to determine whether to start an LLC, and if so, then going to step S2; otherwise, going to step S8; S2: starting the LLC; S3: detecting the mains supply so as to determine whether to switch from the mains supply to a battery, and if so, then going to step S4; otherwise, going to step S5; S4: performing a frequency-fixed adjustment on the LLC with an operating frequency larger than a resonating frequency by a preset magnitude while clearing an integral quantity within a first preset time T1; and performing a frequency-fixed adjustment on the LLC with an operating frequency equal to the resonating frequency while clearing the integral quantity between the first preset time T1 and a second preset time T2, and going to step S8; S5: determining whether the LLC-in-series resonant converter has an overload, and if so, then going to step S6; otherwise, going to step S7; S6: perfo

Abstract: A micro-device includes a movable part, a frame and a connecting part. The movable part has a main portion, a first capacitor electrode and a first driver electrode. The capacitor electrode and the driver electrode have electrode teeth extending from the main portion. The frame includes second capacitor and driver electrodes, where the second capacitor electrode has electrode teeth extending toward the first capacitor electrode, and the second driver electrode has electrode teeth extending toward the first driver electrode. The connecting part connects the movable part to the frame. The first and second capacitor electrodes have their electrode teeth overlapped in their initial position. The movable part is rotatable for varying the extent of the overlapping between the first and second driver electrodes.

Abstract: A MEMS device includes a substrate, a fixed electrode that is provided on the substrate and allows a signal to pass therethrough, a movable electrode that is provided above the substrate in a manner to face the fixed electrode and allows a signal to pass therethrough, a driving line that is provided inside the substrate and used to apply a driving voltage to displace the movable electrode, and a resistance that is provided in a first via hole formed inside the substrate and used to cutoff a signal. The fixed electrode or the movable electrode is connected to the driving line through the first resistance.

Abstract: A variable capacitor is provided which is appropriate for suppressing fluctuation in driving voltage characteristic and for achieving a larger variation ratio of static capacitance. The variable capacitor includes a fixed electrode and a movable electrode. The fixed electrode includes a first opposing face, while the movable electrode includes a second opposing face that faces the first opposing face. The movable electrode further includes a curved portion that protrudes toward the fixed electrode. The variable capacitor also includes a dielectric pattern provided on the first opposing face.

Abstract: An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

Abstract: A drive control method for a micro machine device is provided. The micro machine device is made up of first and second electrodes opposed to each other and a dielectric layer disposed between them. The drive control method includes the steps of applying a control voltage between the first and the second electrodes so that an electrostatic force is exerted on the first and the second electrodes for displacing the first or the second electrode, and switching polarity of the control voltage at a predetermined period or a shorter period.

Abstract: An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

Abstract: In a method for drive controlling a micro machine device including two electrodes opposing each other and a dielectric layer sandwiched therebetween, a control voltage in a rectangular waveform in which positive and negative polarities are alternately inverted is applied between the two electrodes. A current passing through the micro machine device due to the application of the control voltage are detected with respect to positive and negative sides, and parameters related to a capacitance of the micro machine device are acquired with respect to the positive and negative sides on the basis of the detected current. The control voltage is controlled so that the parameters acquired with respect to the positive and negative sides accord with each other. Thus, variation of the capacitance between the positive side and the negative side can be suppressed in switching drive of a variable capacitance device.

Abstract: An electronic component includes a substrate, and a capacitor unit on the substrate. The capacitor unit has a laminate structure including a first electrode layer provided on the substrate, a second electrode layer opposed to the first electrode layer, and a dielectric layer disposed between the first and the second electrode layers. The first electrode layer has a multilayer structure including an adhesion metal layer joined to the dielectric layer. The adhesion metal layer is provided with an oxide coating on a side of the dielectric layer.

Abstract: A method of making a microstructure with thin wall portions (T1-T3) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer (11) and a second conductive layer (12) having a thickness of the thin wall portions (T1-T3), where the etching is performed from the side of the first conductive layer (11) thereby forming in the second conductive layer (12) pre thin wall portions (T1?-T3?) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer (12) and contact the first conductive layer (11). The method also includes a step of performing a second etching process from the side of the first conductive layer (11) for removing part of the first conductive layer (11) contacting the pre thin wall portions (T1?-T3?) to form the thin wall portions.

Abstract: The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.

Abstract: A filter includes a first resonance line and a second resonance line which extend from an input point where a high frequency signal is input, wherein an electrical propagation length L1 of the first resonance line is set at L1=[?1/4]×n and an electrical propagation length L2 of the second resonance line is set at L2=[?2/4]×n, wherein ?1 and ?2 are wavelengths of specified high frequency signals and n is positive odd number.

Abstract: A filter includes a substrate; a signal line formed on the substrate and including an input terminal and an output terminal at either end of the signal line; and a first pair of resonant lines connected between the signal line and a ground portion, wherein the first pair of resonant lines are connected to the signal line at the same point.

Abstract: There is provided a method for manufacturing an electronic device including: printing a conductive pattern on a first surface of a first green sheet having a multilayer structure, the conductive pattern being electrically connected to an internal interconnection formed in the first green sheet; superposing a second green sheet on the first surface of the first green sheet, the second green sheet having an opening located in an area corresponding to the conductive pattern; pressurizing the first green sheet and the second green sheet superposed thereon in directions in which the second green sheet is superposed on the first green sheet; burning the first green sheet and the second green sheet superimposed thereon to thus form a multilayer ceramic substrate; and mounting an electronic element on a second surface of the multilayer ceramic substrate opposite to the first surface, the electronic element being electrically connected to the internal interconnection.

Abstract: An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.

Abstract: An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.

Abstract: A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.

Abstract: An electronic device includes an insulative substrate, a spiral inductor formed by an interconnection layer provided on a first surface of the insulative layer, a first chip that is mounted on a second surface of the insulative layer opposite to the first surface and is electrically connected to a passive circuit including the spiral inductor, the first chip having an electrically conductive substrate, and a first protrusion that is provided on one of the first and second surface of the insulative substrate and protrudes therefrom, the first protrusion being electrically connected to one of the passive circuit and the first chip to an external circuit.