Patents by Inventor Xicai JING

Xicai JING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Boiling enhancement structures for immersion cooled electronic systems
    Patent number: 12293956
    Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 6, 2025
    Assignee: Intel Corporation
    Inventors: Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang Xia, David Shia, Mohanraj Prabhugoud, Maria de la Luz Belmont, Oscar Farias Moguel, Andres Ramirez Macias, Javier Avalos Garcia, Jessica Gullbrand, Shaorong Zhou, Chia-Pin Chiu, Xiaojin Gu
  • IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
    Publication number: 20240260228
    Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.
    Type: Application
    Filed: April 1, 2022
    Publication date: August 1, 2024
    Inventors: Jimmy Chuang, Jin Yang, Yuan-Liang Li, David Shia, Yuehong Fan, Hao Zhou, Sandeep Ahuja, Peng Wei, Ming Zhang, Je-Young Chang, Paul J. Gwin, Ra'anan Sover, Lianchang Du, Eric D. McAfee, Timothy Glen Hanna, Liguang Du, Qing Jiang, Xicai Jing, Liu Yu, Guoliang Ying, Cong Zhou, Yinglei Ren, Xinfeng Wang
  • BOILING ENHANCEMENT STRUCTURES FOR IMMERSION COOLED ELECTRONIC SYSTEMS
    Publication number: 20210327787
    Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 21, 2021
    Inventors: Jin YANG, Jimmy CHUANG, Xicai JING, Yuan-Liang LI, Yuyang XIA, David SHIA, Mohanraj PRABHUGOUD, Maria de la Luz BELMONT, Oscar FARIAS MOGUEL, Andres RAMIREZ MACIAS, Javier AVALOS GARCIA, Jessica GULLBRAND, Shaorong ZHOU, Chia-Pin CHIU, Xiaojin GU