Patents by Inventor Xidong Yao

Xidong Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220247895
    Abstract: This application provides a photographing device. The photographing device includes a housing, configured to carry an electronic component of the photographing device, such as a lens module and an expansion module. A lens cavity and an expansion cavity isolated from each other are disposed in the housing. The lens module is disposed in the lens cavity, a heat dissipation apparatus is disposed in the expansion cavity, and the expansion module is disposed on the heat dissipation apparatus and is thermally connected to the heat dissipation apparatus. In addition, the disposed heat dissipation apparatus is further thermally connected to the lens module. A heat dissipation channel isolated from the expansion cavity is disposed in the heat dissipation apparatus. Therefore, an effect of dissipating heat from the expansion module and the lens module may be improved through air flowing in the heat dissipation channel.
    Type: Application
    Filed: April 22, 2022
    Publication date: August 4, 2022
    Inventors: Xidong Yao, Yeren Wang, Bingbing Tong
  • Publication number: 20210410336
    Abstract: The cabinet includes a body and a heat dissipation apparatus. A plurality of installation slots for servers to enter along a preset installation direction are disposed on the body. The heat dissipation apparatus is configured to perform heat dissipation on devices of the servers, the heat dissipation apparatus is disposed on at least one side of the body along the installation direction, and the heat dissipation apparatus is connected to the devices of the servers. In this way, heat dissipation is performed on each server in the body, and space reserved between two adjacent rows of cabinets can be effectively used to reduce occupation of space in a left-right direction or an up-down direction in the body, thereby reducing limitation on a size of the cabinet and a size of a device in the cabinet.
    Type: Application
    Filed: September 14, 2021
    Publication date: December 30, 2021
    Inventors: Xidong YAO, Xiaoguang SUN, Dongming LU
  • Patent number: 10122411
    Abstract: A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: November 6, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Changyi Liu, Xudong Fei, Xidong Yao
  • Publication number: 20170310363
    Abstract: A communications device is disclosed, the device includes a container, at least one power module, at least one temperature regulating module, and multiple boards. The container is configured to accommodate the at least one temperature regulating module and the multiple boards, and the container is further configured to accommodate a power bus layer. The power bus layer is connected to the at least one power module, the at least one temperature regulating module, and the multiple boards. The at least one power module is configured to supply power to the at least one temperature regulating module and the multiple boards by using the power bus layer. At least part of communication among the multiple boards, the at least one power module, and the at least one temperature regulating module is performed in a power line communications manner by using the power bus layer.
    Type: Application
    Filed: July 6, 2017
    Publication date: October 26, 2017
    Inventors: Changyi Liu, Xudong Fei, Xidong Yao