Abstract: Disclosed are a heat sink fixing structure and a board-level heat dissipation apparatus. The heat sink fixing structure comprises a support structure and a floating structure; the support structure comprises a first support member for providing support for the semiconductor component and a second support member spaced apart from the first support member; the heat sink is arranged corresponding to the semiconductor component and is connected to the second support member in a floating configuration, making it adaptable to semiconductor components of different heights and tolerances, effectively reducing the temperature of semiconductor components and improving long-term reliability. By using the first and second support members to respectively support the heat sink and semiconductor components, the number of openings near the semiconductor component on the integrated circuit board is reduced, thereby reducing the wiring difficulty of the integrated circuit board and reducing the stress it bears.

Abstract: This invention involves and discloses a heat control device for power equipment, which comprises heat source, heat sink base plate, heat insulation layer, dissipation heat sink and thermal control switch, wherein the heat source is placed on and in contact with dissipation heat sink, and its bottom is in direct lap joint with heat sink base plate, wherein the heat insulation layer is set around heat sink base plate, wherein the thermal control switch is placed on heat sink base plate. This invention of heat control device is one that demonstrates excellent low temperature thermal insulation property for key components or heat-sensitive elements of power equipment. The heat control device applying technical solutions described in this invention features easy manufacturing, low cost and reliable performance.

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract: This invention involves and discloses a heat control device for power equipment, which comprises heat source, heat sink base plate, heat insulation layer, dissipation heat sink and thermal control switch, wherein the heat source is placed on and in contact with dissipation heat sink, and its bottom is in direct lap joint with heat sink base plate, wherein the heat insulation layer is set around heat sink base plate, wherein the thermal control switch is placed on heat sink base plate. This invention of heat control device is one that demonstrates excellent low temperature thermal insulation property for key components or heat-sensitive elements of power equipment. The heat control device applying technical solutions described in this invention features easy manufacturing, low cost and reliable performance.

Abstract: Embodiments of the present invention provide an apparatus with a heat insulation structure, where the apparatus includes an object to be heat-insulated and also includes a heat insulation closed layer disposed between the object to be heat-insulated and a heat source. The heat insulation structure adopted in the present invention specifically is a heat insulation closed layer, where the heat insulation closed layer performs heat insulation protection through a closed space between the object to be heat-insulated and the heat source, rather than performing heat insulation mainly through a physical material with a small heat conduction coefficient.

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.